Cyclic oxidation of β-NiAl with various reactive element dopants at 1200 °C
Highlights
► Reactive element (RE) doped β-NiAl alloys are produced by arc-melting. ► Cyclic oxidation behavior of the RE-doped alloys is compared. ► Effects of RE ion size and solubility on cyclic oxidation of NiAl are discussed. ► A co-doping strategy is proposed to optimize the cyclic oxidation performance.
Introduction
The high melting point, low density and good isothermal oxidation resistance of β-NiAl intermetallic compound has been widely documented over the past decades [1], [2], [3]. Recently, β-NiAl has been considered as a potential candidate for high-temperature protection of underlying superalloy substrates and suitable bond coat in thermal barrier coating (TBC) system due to these desirable properties [4], [5], [6], [7], [8], [9], [10]. However, the alumina scale formed on NiAl spalls readily during high-temperature cyclic oxidation, especially above 1200 °C.
To improve oxide scale adhesion to NiAl alloy or coating, RE additions of Hf, Zr, Y and La as well as their oxides dispersions in NiAl were systematically studied [11], [12], [13], [14], [15]. Numerous attempts have been made to clarify the beneficial RE effects on cyclic oxidation performance, but the mechanical explanation is still in debate. For alumina-forming alloys, a continuous flux of RE ions diffusing from the alloy to the scale/alloy interface and then to the scale grain boundaries is essential to realize the beneficial RE effects, which is recognized as dynamic segregation theory (DST) [16], [17]. It reveals that the reduction in oxide scale growth rate by RE doping is due to the slow outward diffusion of RE ions inhibiting the outward diffusion of Al ions. Several hypotheses are also proposed concerning the enhancement on oxide scale adhesion by RE additions [18], [19], [20], [21], [22], [23], [24]. The formation of voids beneath the oxide scale weakens the interfacial bonding and impurity elements such as sulfur in alloys segregates to the scale/alloy interface and promotes the interfacial void growth. RE ions are considered reacting and tying up sulfur due to their strong affinity for sulfur [18], [19], [25], [26]. Apart from sulfur, other impurities such as C, O and P in alloys might be also detrimental to the oxidation performance [27], [28], [29]. Recent studies have indicated that mechanical interlocking of the oxide scale by “pegs” formed at the oxide/metal interface plays a dominate role in improving scale adhesion, while the excellent oxidation resistance of oxide dispersion strengthened alumina-forming alloys reveals that this pegging mechanism is sufficient but not necessary for optimizing the oxidation performance [14], [17], [23], [24].
Dysprosium (Dy) is also a typical reactive element, but its benefit in improving oxidation resistance of alumina-formers has been just reported in recent years. The addition of Dy in NiAl significantly improved cyclic oxidation performance in mechanisms similar to other RE additions did [30], [31], [32], [33]. However, no efforts are made to compare the capabilities of improving oxide scale adhesion between Dy and other reactive elements as quantifying the beneficial RE effects is rather difficult. In attempting to do this, identifying the differences in solubility, reactivity and diffusion kinetics between these reactive elements in Ni–Al system are necessary.
Early results suggested that similar mechanisms occurred when the RE was doped in NiAl as either an oxide dispersion or an alloy addition, but the addition of RE as an oxide dispersion which strengthens the alloy substrate might deteriorate oxide scale adhesion as a weaker substrate is better able to dissipate strain energy by deforming [14], [17], [34], [35]. Besides, ion implantation is less effective in improving the performance of alumina-formers than chromia-formers [36], [37], [38]. Therefore, arc-melting was chosen for specimen preparation in the present work.
In this work, a comparative research is carried out on different RE-doped NiAl alloys to investigate into the roles of different reactive elements in affecting the oxide scale growth rate and scale adhesion, to better understand those factors affecting the strength of the RE effects.
Section snippets
Alloy preparation and evaluation
NiAl alloys containing various reactive elements were used in this work. To ensure that each reactive element in the alloy had an optimized concentration, the nominal doping level of each reactive element was ascertained according to literature values [11], [12], [13], [14], [15]. The designed compositions were Ni–50Al, Ni–49.95Al–0.05Dy, Ni–49.95Al–0.05Hf, Ni–49.9Al–0.1Zr, Ni–49.92Al–0.08Y and Ni–49.9Al–0.1La (in at.%), respectively. High purity nickel, aluminum and reactive elements (Dy, Hf,
Comparison of oxide scale growth rate
Fig. 1 shows the difference in the mass gain between the RE-doped and undoped NiAl samples during 300 h cyclic oxidation at 1200 °C. Since the mass gain is obtained by weighing both the sample and the spalled oxides, it has been widely used to evaluate the oxide scale growth rate. The 0.05 at.% Hf doped sample and 0.09 at.% Zr doped sample yielded a mass gain of 1.05 and 1.09 mg/cm2, respectively, reducing the scale growth rate by seven eighths compared to the undoped sample (7.82 mg/cm2). The
Conclusions
Cyclic oxidation behaviour of β-NiAl alloys with 0.05 Dy, 0.05 Hf, 0.09 Zr, 0.06 Y and 0.09 La doping (all in at.%) was compared at 1200 °C. Conclusions can be drawn as follows:
- (1)
All the RE dopants effectively suppressed growth of voids between the oxide scale and the alloy.
- (2)
Among the doped alloys, the La-doped alloy had much faster oxide scale growth due to its severe internal oxidation. Also, the alloy revealed larger scale rumpling.
- (3)
As compared to the Hf or Zr-doped alloys, the Dy-doped alloy
Acknowledgements
This research is sponsored by National Nature Science Foundations of China (NSFC) under Grant Nos. 51071013 and 51231001 and National Basic Research Program (973 Program) of China under Grants Nos. 2010CB631200 and 2012CB625100.
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