Transactions of Nonferrous Metals Society of China
Fabrication and testing of phase change heat sink for high power LED
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Cited by (25)
Pool boiling enhancement of novel interconnected microchannels with reentrant cavities for high-power electronics cooling
2020, International Journal of Heat and Mass TransferCitation Excerpt :Additionally, the P/E process can be performed on a planning machine, which is convenient and inexpensive. Therefore, the P/E method is highly suitable for microstructure fabrication to enhance heat transfer performance in industrial applications and is successfully applied in heat pipes and heat sinks [30, 31]. Recently, Zeng et al. fabricated a micro-grooved structure with a reentrant cavity array (MGRA) using the orthogonal P/E method and utilized it as a wick in ultra-thin aluminum vapor chambers [32, 33].
Optimization of three-dimensional boiling enhancement structure at evaporation surface for high power light emitting diode
2018, Transactions of Nonferrous Metals Society of China (English Edition)Pool boiling performance and bubble dynamics on microgrooved surfaces with reentrant cavities
2017, Applied Thermal EngineeringCitation Excerpt :Besides, the rough surface for the P/E grooves and the favorable capillary performance of the P/E grooves has been justified in Ref. [28]. Due to the superior heat and mass transfer characteristics of P/E grooves, it has also been successfully applied to the field of heat pipes [29], heat sinks [30] and heat columns [31]. More importantly, the P/E process could be conducted on general machine tools, such as planing tools, which is facile [32].
Combined convection and radiation heat transfer of the radially finned heat sink with a built-in motor fan and multiple vertical passages
2015, International Journal of Heat and Mass TransferCitation Excerpt :Wang [3] experimentally and theoretically explored the heat transfer performances of three LED substrates. He found that the heat-transfer capacity of the vapor chamber plate is better than that of the copper or aluminum substrate when the input power is higher than 5 W. Xiang et al. [4] developed a new phase-change heat sink for high-power LED lamps. Its three-dimensional structure consists of the circumambient spiral micro grooves and the radial micro grooves.
Cooling performance enhancement of LED (Light Emitting Diode) using nano-pastes for energy conversion application
2014, EnergyCitation Excerpt :Ye et al. [13] reported that the LED package temperature remained below 115 °C with a LED power up to 2.8 W due to the phase transition of coolant. Xiang et al. [14] reported a thermal resistance of 0.09 °C/W and a maximum temperature of 86.8 °C by using alcohol or water as a refrigerant. Chen et al. [15] reported that the thermal resistance could be reduced about 45% by using ionic wind.
Thermal optimization of PCM based pin fin heat sinks: An experimental study
2013, Applied Thermal EngineeringCitation Excerpt :Nayak et al. [17] considered a porous matrix, plate and pin fins as the TCEs for the numerical investigation. Xiang et al. [18] developed a PCM based heat sink for cooling high power light emitting diode. Ye et al. [19] analyzed the fluid flow patterns and the heat transfer in a plate fin unit.
Foundation item: Projects (50436010, 50930005) supported by the National Natural Science Foundation of China; Project (U0834002) supported by the Joint Fund of NSFC-Guangdong of China