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Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

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Abstract

The effects of Mn addition (0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) on microstructure, shear mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 °C with different aging time (0, 250, 500, and 750 h). It is found that Mn addition can increase fracture energy of joints without decreasing the shear strength. And the microstructures have transformed from the eutectic net-like structure in SAC305 solder joints into the structures based on β-Sn matrix with intermetallic compounds (IMCs) distributed. By doping 0.07 wt.% Mn, the Cu6Sn5 growth along the SAC305/Cu interface during thermal aging can be inhibited to some extent. During isothermal aging at 170 °C, the maximum shear force of solder joint decreases continuously with aging time increasing, while the fracture energy rises first and then decreases, reaching the maximum at 500 h compared by that with the microstructure homogenization. Cu3Sn growth between Cu6Sn5/Cu interface has been retarded most at the aging time of 250 h with 0.07 wt.% Mn-doped joints. With the aging time prolonging, the inhibition effect of Mn on Cu3Sn IMC layer becomes worse. The strengthening effect of Mn can be explained by precipitation strengthening, and its mechanical behavior can be predicted by particle strengthening model proposed by Orowan.

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Acknowledgements

The authors gratefully acknowledge the support received from Yunnan Fundamental Research Projects (Grant No. 202101BC070001-007), the Jiangsu Province Industry-University-Research Cooperation Project (No. BY2022832), and the National Natural Science Foundation of China (No. 52275339).

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Authors and Affiliations

  1. School of Material Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212003, Jiangsu, China

    Cheng-ming Li, Shu-jin Chen & Xiao-jing Wang

  2. R&D Center, Yunnan Tin Group (Holding) Co., Ltd., Kunming, 650000, Yunnan, China

    Shan-shan Cai & Ju-bo Peng

  3. Modern School of Engineering, Yunnan University, Kunming, 650091, Yunnan, China

    Ying-wu Wang

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  1. Cheng-ming Li
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Correspondence to Shan-shan Cai or Xiao-jing Wang.

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Li, Cm., Chen, Sj., Cai, Ss. et al. Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging. J. Iron Steel Res. Int. 30, 1650–1660 (2023). https://doi.org/10.1007/s42243-023-01027-y

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