Abstract
We computationally investigate the infrared (IR) emissivity of single, double, and triple-layer thin films for efficient heat dissipation in extreme ultraviolet (EUV) lithography pellicles. It is found that multilayer structures can offer enhanced thermal emissivity compared to single materials. We demonstrate correlations between the total absorbance and the complex refractive indices of constituent layers, providing insights into optimal parameter combinations for enhanced IR emissivity. In addition, we perform principal component analysis for triple-layer systems, identifying the most influential combinations of the constituent layers. Overall, our study can contribute to optimize thin film configurations for achieving efficient heat dissipation and enhancing the stability and reliability of EUV pellicles.
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Acknowledgements
This research was financially supported by Chonnam National University (Grant number: 2021-2433).
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Hwang, J. Enhancing infrared emissivity of thin films through multilayer configurations. J. Korean Phys. Soc. 83, 957–963 (2023). https://doi.org/10.1007/s40042-023-00933-4
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DOI: https://doi.org/10.1007/s40042-023-00933-4