Abstract
Ultra-wide bandgap (Eg > 3.4 eV) channel HEMTs are attractive choice for next generation power electronics. In recent years, β-Ga2O3 based field effect transistors are demonstrating excellent device performance due to its high breakdown field (Ecr ~ 8 MV/cm) and good transport properties. We report DC and RF characteristics of AlN/β-Ga2O3 HEMTs on Silicon Carbide (SiC) substrate. Compared with conventional III-nitride channel-based HEMTs, the AlN/β-Ga2O3 HEMT shows larger 2DEG (two-dimensional electron gas) density, improved drain current density, and breakdown voltage with low on-resistance. The gate field plate AlN/β-Ga2O3 HEMT with gate length (LG) of 800 nm and gate-drain (LGD) distance of 1 μm, and source-drain distance (LSD) of 2.6 μm shows ON-state current density (IDS) of 0.6 A/mm, transconductance (gm) of 288 mS/mm, blocking voltage (VBR) of 509 V, on-resistance (Ron) of 1.13 Ω.mm, current gain cut-off frequency (FT) of 27.1 GHz, power gain cut-off frequency (FMAX) of 72.3 GHz, and Johnson Figure of merit (JFoM = VBR× FT) of 13.793 THz.V. Moreover, the proposed HEMT exhibits very low switching delay of 3.5 pS, and switching loss of 1.9 × 10−16 J. These findings reveal that the proposed AlN/β-Ga2O3 HEMTs on SiC substrate are suitable candidates for future portable low switching loss power converters and RF applications.
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The authors acknowledge the Anil Neerukonda Institute of Technology and Sciences, Visakhapatnam, India-531 162 and SKP Engineering College, Thiruvannamalai, India-606 601 for providing the support and facility to carry out this research work.
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All the works in this paper have done together by S. Baskaran, M. Shunmugathammal, C. Sivamani, S. Ravi, P. Murugapandiyan, and N.Ramkumar.
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Baskaran, S., Shunmugathammal, M., Sivamani, C. et al. UWBG AlN/β-Ga2O3 HEMT on Silicon Carbide Substrate for Low Loss Portable Power Converters and RF Applications. Silicon 14, 11079–11087 (2022). https://doi.org/10.1007/s12633-022-01846-w
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DOI: https://doi.org/10.1007/s12633-022-01846-w