Abstract
In this work, with the help of extensive technology computer-aided design simulations, we report a comprehensive study of MOSFET based circuit design using ultra-thin body III-V on-insulator (OI) CMOS transistors. We demonstrate the circuit performance of III-V CMOS by combining InAs-OI n-channel and GaAs-OI junction-less p-channel transistors. The performance metrics of different circuits designed using III-V transistors are also compared with III-V/Germanium and Silicon-on-insulator (SOI) based CMOS logic. CMOS inverter circuit designed using III-V/Ge (InAs-OI/GeOI) CMOS shows 51% and 17% reduction in rise and fall time compared to SOI CMOS. The oscillation frequency of the ring oscillator designed using III-V/Ge (InAs-OI/GeOI) and III-V (InAs-OI/GaAs-OI) CMOS logic is approximately three times and two times higher than SOI based design. The unity-gain bandwidth of the inverting amplifier using III-V/Ge (InAs-OI/GeOI) and III-V (InAs-OI/GaAs-OI) architecture is 22 times and 9.5 times higher compared to SOI CMOS based circuit. Static noise margin (SNM) of conventional six-transistor (6-T) SRAM cell is also analyzed during hold operation. Due to the poor electrostatic integrity of III-V transistors, degradation in SNM is observed compared to its SOI counterparts. The cascode low noise amplifier (LNA) circuit designed using InAs-OI transistor shows the higher gain and low noise figure at the same operating frequency compared to the SOI transistor-based LNA.
Similar content being viewed by others
References
del Alamo JA (2011) Nanometre-scale electronics with III-V compound semiconductors. Nature 479:317–323. https://doi.org/10.1038/nature10677
Bhuwalka K, Wu Z, Noh H, Lee W, Cantoro M, Heo Y, Jin S, Choi W, Kwon U, Maeda S, Lee K, Park Y (2015) In0.53Ga0.47As-Based nMOSFET design for low standby power applications. IEEE Trans Electron Devices 62 (9):2816–2823. https://doi.org/10.1109/TED.2015.2445977
Lin J, Antoniadis DA, del Alamo JA (2014) Novel intrinsic and extrinsic engineering for high-performance high-density self-aligned ingaas mosfets: Precise channel thickness control and sub-40-nm metal contacts. In: 2014 IEEE International electron devices meeting, pp 25.1.1–25.1.4 https://doi.org/10.1109/IEDM.2014.7047104
Kim S, Myeong Geum D, Park M, Choi W (2015) InGaAs on insulator metal oxide semiconductor field effect transistors utilizing Y2O3 buried-oxide. IEEE Electron Device Lett 36(5):451–453
Kim S, Yokoyama M, Nakane R, Ichikawa O, Osada T, Hata M, Takenaka M, Takagi S (2013) High performance extremely-thin body InAs-on-insulator MOSFETs on Si with Ni-InGaAs metal S/D by contact resistance reduction technology. In: VLSI technology (VLSIT), 2013 symposium on, pp T52–T53
Takagi S, Kim S, Yokoyama M, Zhang R, Taoka N, Urabe Y, Yasuda T, Yamada H, Ichikawa O, Fukuhara N, Hata M, Takenaka M (2013) High mobility CMOS technologies using III-V/Ge channels on Si platform. Solid State Electron 88:2–8
Shim JP, Kim SK, Kim H, Ju G, Lim H, Kim S, Jun Kim H (2018) Double-gated ultra-thin-body GaAs-on-insulator p-FETs on si. APL Materials 6(1):016103. https://doi.org/10.1063/1.5000532
Hutin L, Le Royer C, Damlencourt J, Hartmann J, Grampeix H, Mazzocchi V, Tabone C, Previtali B, Pouydebasque A, Vinet M, Faynot O (2010) GeOI pMOSFETs scaled down to 30-nm gate length with record off-state current. IEEE Electron Device Lett 31(3):234–236. https://doi.org/10.1109/LED.2009.2038289
Romanjek K, Hutin L, Le Royer C, Pouydebasque A, Jaud M, Tabone C, Augendre E, Sanchez L, Hartmann J, Grampeix H, Mazzocchi V, Soliveres S, Truche R, Clavelier L, Scheiblin P, Garros X, Reimbold G, Vinet M, Boulanger F, Deleonibus S (2008) High performance 70nm gate length Germanium-On-Insulator pMOSFET with high- /metal gate. In: ESSDERC 2008 - 38th European solid-state device research conference, pp 75–78. https://doi.org/10.1109/ESSDERC.2008.4681702
Tewari S, Biswas A, Mallik A (2015) Performance of CMOS with Si pMOS and asymmetric InP/InGaAs nMOS for analog circuit applications. IEEE Trans Electron Devices 62(5):1655–1658. https://doi.org/10.1109/TED.2015.2409372
Maity SK, Pandit S. (2017) Study of G-S/D underlap for enhanced analog performance and rf/circuit analysis of UTB inas-OI-si MOSFET using NQS small signal model. Superlattice Microst 101:362–372. https://doi.org/10.1016/j.spmi.2016.11.053
Maity SK, Pandit S (2017) Effects of BOX engineering on analogue/RF, and circuit performance of InGaAs-OI-Si MOSFET. Int J Electron 104(11):1777–1794. https://doi.org/10.1080/00207217.2017.1312715
Maity SK, Pandit S (2020) Analysis of scaling of thickness of the buffer layer on analog/RF and circuit performance of InAs-OI-Si MOSFET using NQS model. INT J NUMER MODEL EL 33(1):e2664. https://doi.org/10.1002/jnm.2664
Maity SK, Haque A, Pandit S (2020) Charge-based compact drain current modeling of Inas-OI-Si MOSFET including subband energies and band nonparabolicity. IEEE Trans Electron Devices 67(6):2282–2289. https://doi.org/10.1109/TED.2020.2984578
Dong L, Wang XW, Zhang JY, Li XF, Lou XB, Conrad N, Wu H, Gordon RG, Ye PD (2014) III-V CMOS devices and circuits with high-quality atomic-layer-epitaxial La2O3/GaAs interface. In: 2014 Symposium on VLSI technology (VLSI-Technology): digest of technical papers, pp 1–2. https://doi.org/10.1109/VLSIT.2014.6894361
Yokoyama M, Iida R, Ikku Y, Kim S, Takagi H, Yasuda T, Yamada H, Ichikawa O, Fukuhara N, Hata M, Takenaka M, Takagi S (2013) Formation of III-V-on-insulator structures on Si by direct wafer bonding. Semicond Sci Technol 28:1–10
Kim S, Yokoyama M, Taoka N, Iida R, Lee S, Nakane R, Urabe Y, Miyata N, Yasuda T, Yamada H, Fukuhara N, Hata M, Takenaka M, Takagi S (2011) High performance extremely-thin body III-V-on-insulator MOSFETs on a Si substrate with Ni-InGaAs metal S/D and MOS interface buffer engineering. In: VLSI technology (VLSIT), 2011 symposium on, pp 58–59
Synopsys (2019) Sentaurus TCAD Manuals. V.2019 edn
ITRS (2010) International technology roadmap for semiconductors: ITRS 2010 updates. http://www.itrs.net/Links/2010ITRS/Home2010.htm
NSM (2019) Ioffe institute of the russian academy of sciences. www.ioffe.ru/SVA/NSM/semicond/
Canali C, Majni G, Minder R, Ottaviani G (1975) Electron and hole drift velocity measurements in silicon and their empirical relation to electric field and temperature. IEEE Trans Electron Device 22(11):1045–1047. https://doi.org/10.1109/T-ED.1975.18267
Bufler FM, Asahi Y, Yoshimura H, Zechner C, Schenk A, Fichtner W (2003) Monte carlo simulation and measurement of nanoscale n-mosfets. IEEE Trans Comput-Aided Des Integrated Circ Syst. 50 (2):418–424. https://doi.org/10.1109/TED.2002.808420
Ancona M, Iafrate GJ (1989) Quantum correction to the equation of state of an electron gas in a semiconductor. Phys Rev B 39(13):9536–9540
Lombardi C, Manzini S, Saporito A, Vanzi M (1988) A physically based mobility model for numerical simulation of nonplanar devices. IEEE Trans Comput-Aided Des Integrated Circ Syst. 7(11):1164–1171. https://doi.org/10.1109/43.9186
Kim S, Yokoyama M, Taoka N, Iida R, Lee S, Nakane R, Urabe Y, Miyata N, Yasuda T, Yamada H, Fukuhara N, Hata M, Takenaka M, Takagi S (2013) Experimental study on electron mobility in InxGa1−xAs-on-insulator metal-oxide-semiconductor field-effect transistors with in content modulation and MOS interface buffer engineering. IEEE Trans Nanotechnol 12(4):621–628. https://doi.org/10.1109/TNANO.2013.2265435
Kim S, Yokoyama M, Taoka N, Nakane R, Yasuda T, Ichikawa O, Fukuhara N, Hata M, Takenaka M, Takagi S (2013) Sub-60-nm extremely thin body In 1 − x GaxAs -On-Insulator MOSFETs on Si with Ni-InGaAs Metal S/D and MOS interface buffer engineering and its scalability. IEEE Trans Electron Device 60(8):2512–2517. https://doi.org/10.1109/TED.2013.2270558
Hellings G, Eneman G, Krom R, De Jaeger B, Mitard J, De Keersgieter A, Hoffmann T, Meuris M, De Meyer K (2010) Electrical tcad simulations of a germanium pmosfet technology. IEEE Trans Electron Devices 57(10):2539–2546. https://doi.org/10.1109/TED.2010.2060726
Esseni D, Mastrapasqua M, Celler GK, Baumann FH, Fiegna C, Selmi L, Sangiorgi E (2000) Low field mobility of ultra-thin SOI N- and P-MOSFETs: measurements and implications on the performance of ultra-short MOSFETs. In: International electron devices meeting 2000. technical digest. IEDM (Cat. No.00CH37138), pp 671–674,. https://doi.org/10.1109/IEDM.2000.904408
Tian Y, Huang R, Zhang X, Wang Y (2005) A novel nanoscaled device concept: quasi-SOI MOSFET to eliminate the potential weaknesses of UTB SOI MOSFET. IEEE Trans Electron Devices 52(4):561–568. https://doi.org/10.1109/TED.2005.844737
Takagi S, Iisawa T, Tezuka T, Numata T, Nakaharai S, Hirashita N, Moriyama Y, Usuda K, Toyoda E, Dissanayake S, Shichijo M, Nakane R, Sugahara S, Takenaka M, Sugiyama N (2008) Carrier-transport-enhanced channel CMOS for improved power consumption and performance. IEEE Transactions on Electron Devices 55(1):21–39. https://doi.org/10.1109/TED.2007.911034
Lee TH (2003) The Design of CMOS Radio-Frequency Integrated Circuits, 2nd edn. Cambridge University Press, Cambridge. https://doi.org/10.1017/CBO9780511817281
Acknowledgements
The second author thanks Department of Electronics and Information Technology, Govt. of India for utilizing the resources obtained under the SMDP-C2SD project at the University of Calcutta.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher’s Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Maity, S.K., Pandit, S. Performance Assessment of CMOS circuits using III-V on Insulator MOS Transistors. Silicon 13, 1939–1949 (2021). https://doi.org/10.1007/s12633-020-00582-3
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12633-020-00582-3