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Rotational plating process design with computational fluid analysis

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Abstract

During the semiconductor manufacturing process and equipment development, we designed a face-up type electro-plating process and equipment including technologies of single wafer processing, wafer handling, and cyclic fluid delivery. In this study, with the help of computational fluid dynamics, we presented the flow effect on the wafer from the viewpoint of the coating uniformity. Process and hardware parameters, such as the electrode rotating speed, the gap between the electrode and the wafer, and the electrode shape were considered. The electrode height of 10 mm exhibited the best results, and this may be caused by the shoulder gap location to the outlet duct. A rotating speed of 5 rpm was shown to produce better results than those at other speeds. The butterfly wing and the meshed disk electrode showed a similar tendency in terms of the rotating speed and the gap. However, the butterfly-wing-type might show less uniform results than those of the meshed disk due to its original non-uniformity in the circumferential direction in case of lower rotating speed.

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Acknowledgments

This work was supported by the Ministry of SMEs and Startups (S2500775), Korea, and, FIB-SEM analysis was assisted by the Cooperative Equipment Center at KOREATECH, Korea.

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Authors and Affiliations

  1. Industrial Design Engineering, KOREATECH, Cheonan, 31253, Korea

    Joo-Pyo Hong

  2. Division of Mechanical & Automotive Engineering, Kongju National University, Cheonan, 31080, Korea

    Ki Seok Lee

  3. Solution Lab, Daejeon, 35260, Korea

    Midum Jung

  4. SVS Corp., Anseong, 17562, Korea

    Kyeong-Seop Song

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  1. Joo-Pyo Hong
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Correspondence to Joo-Pyo Hong.

Additional information

This paper was presented at ICMDT 2019, Shiroyama Hotel, Kagoshima, Japan, April 24-27, 2019. Recommended by Guest Editor Haedo Jeong.

Joo-Pyo Hong is a Professor of the Industrial Design Engineering Department, Korea University of Education and Technology (KOREATECH), Cheonan, Korea. He received his B.S., M.S., and Ph.D. in Mechanical Design and Production Engineering from Seoul National University, Seoul, Korea. Prior to his work at KOREATECH, he worked for Samsung Electronics in the semiconductor manufacturing equipment innovation field.

Ki Seok Lee is a Professor of the Division of Mechanical & Automotive Engineering, Kongju National University, Cheonan, Korea. He received his B.S., M.S., and Ph.D. in Mechanical Engineering from KAIST, Daejeon, Korea. Prior to his work at Kongju National University, he worked for Samsung Electronics in the semiconductor manufacturing equipment innovation field.

Midum Jung is a CFD engineer at Solution Lab, Daejeon, Korea. He received his B.S. in Mechanical Engineering from Korea University of Technology and Education (KOREATECH), Cheonan, Korea. His research interest is CFD with complex shapes regarding physical processes.

Kyeong-Seop Song is the Director of the R&D Center, SVS (Scientific Value Solution Corp.), Anseong, Korea. He received his B.S. in Electronics from Hanyang University, Seoul, Korea. He worked for LG Semicon and Hynix corporations in the semiconductor manufacturing process field. Prior to his work at SVS, he also worked on the development of semiconductor/ FPD equipment at KCTech, Anseong, Korea.

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Hong, JP., Lee, K.S., Jung, M. et al. Rotational plating process design with computational fluid analysis. J Mech Sci Technol 33, 5711–5719 (2019). https://doi.org/10.1007/s12206-019-1114-3

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  • DOI: https://doi.org/10.1007/s12206-019-1114-3

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