Abstract
The heat transfer performance of a vapor chamber and its effectiveness in the cooling of electronic devices are experimentally and theoretically investigated in the present work. The power transistor in the circuit board usually operates with electric power that ranges from 15 W to 100 W, which is the heat input to the simulated processor. The heat flux varies between 3300 and 22000 W/m2. The simulated processor is cooled with the forced and induced air cooling methods with and without the use of the vapor chamber. Results show a maximum temperature decrease of 26 % and a maximum increase in the convective heat transfer coefficient of 36 %. The minimum value of the thermal resistance through the vapor chamber and the total thermal resistance is 0.195 and 0.82 °C/W, respectively. The experimental results are compared with the ANSYS predicted values.
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B. Jefferson Raja Bose is an Assistant Professor in Karunya Institute of Technology and Science, Coimbatore. He obtained his Master of Engineering from Anna University Chennai in 2001. He is doing his research in the field of Heat transfer, CFD, and Nanofluids.
Nizar Ahammed is currently pursuing his Ph.D. from Karunya University, Coimbatore, India. He did his undergraduate studies in Mechanical Engineering from Visvesvaraya Technological University, Belgaum, Karnataka in 2007 and post-graduate studies in Mechanical Engineering (Thermal Systems) from Calicut University, Kerala in 2012. His area of research includes electronic cooling with thermoelectric cooler coupled with nanofluid cooled minichannel heat exchanger. He worked as a JRF in a DST-SERB, an India-funded project.
Lazarus Godson Asirvatham is currently an Associate Professor of Mechanical Engineering, School of Engineering and Technology at Karunya University, Coimbatore, India. He received his Doctor of Philosophy in Mechanical Engineering from Anna University, Chennai, India in 2011. His research interests include Nanofluid Heat Transfer, Heat Pipes for Electronic Cooling Applications, Thermoelectric Cooling, Mini and Micro Channel Heat Transfer and Thermal Energy Storage. Professor Godson is the Head of the Centre for Research in Material Science and Thermal Management (CRMS&TM).
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Bose, J.R., Ahammed, N. & Asirvatham, L.G. Thermal performance of a vapor chamber for electronic cooling applications. J Mech Sci Technol 31, 1995–2003 (2017). https://doi.org/10.1007/s12206-017-0349-0
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DOI: https://doi.org/10.1007/s12206-017-0349-0