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Effect of heat source area on the thermal resistance of the wick columns vapor chambers

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Abstract

The results of the spreading thermal resistance, heat transfer and flow characteristics of the vapor chamber embedded with plate fin are investigated. The experiments are performed with the vapor chambers with wick plate and wick columns embedded plate fin. Parametric studies including different heat fluxes, heated surface areas, flow rate of coolants on the cooling performance in terms of the spreading thermal resistance and heat transfer characteristics are considered. A three-dimensional heat and mass transfer model for the vapor chamber with wick plate and wick columns are developed. The velocity and pressure distributions of liquid phase and vapor phase inside the vapor chamber obtained from the simulation are shown. By comparing the experimental results with numerical results, reasonable agreement is obtained. It can be found that the heat input and heat source area have significant effect on the decreasing of the boiling and condensation thermal resistances while they are slightly effect on the decreasing of the convective thermal resistance. Due to the wick plate and wick columns, the capillary force has significant effect on the working fluid circulation, evaporation rate and flow directions of the liquid and vapor phases inside the vapor chamber. The results of this study are of technological importance for the efficient design of cooling system of the personal computer or electronic devices to enhance cooling performance of the vapor chamber.

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References

  1. K. I. Han, S. S. Yee, S. H. Park, S. H. Lee and D. H. Cho, A Study on the improvement of heat transfer performance in low temperature closed thermosyphon, KSME International Journal, 16 (2002) 1102–1111.

    Google Scholar 

  2. K. I. Han, D. H. Cho and J. U. Park, Investigation of boiling heat transfer characteristics of two-phase closed thermosyphons with various internal grooves, KSME lnternational Journal, 17 (2003) 1739–1745.

    Google Scholar 

  3. K. Han and D. H. Cho, Theoretical and experimental studies boiling heat transfer for the thermosyphons with various helical grooves, Journal of Mechanical Science and Technology (KSME Int. J.), 19 (2005) 1662–1669.

    Article  Google Scholar 

  4. K. Lim and H. Roh, Thermal characteristics of graphite foam thermosyphon for electronics cooling, Journal of Mechanical Science and Technology, 19 (2005) 1932–1938.

    Article  Google Scholar 

  5. Y. Koito, H. Imura, M. Mochizuki, Y. Saito and S. Torii, Numerical analysis and experimental verification on ther mal fluid phenomena in a vapor chamber, Applied Thermal Engineering, 26 (2006) 1669–1676.

    Article  Google Scholar 

  6. Y. S. Chen, K. H. Chien, C. C. Wang, T. C. Hung and B. S. Pei, A simplified transient three-dimensional model for estimating the thermal performance of the vapor chambers, Applied Thermal Engineering, 26 (2006) 2087–2094.

    Article  Google Scholar 

  7. S. S. Hsieh, R. Y. Lee, J. C. Shyu and S. W. Chen, Thermal performance of flat vapor chamber heat spreader, Energy Conversion and Management, 49 (2008) 1774–1784.

    Article  Google Scholar 

  8. L. Vasiliev, D. Lossouarn, C. Romestant, A. Alexandre, Y. Bertin, Y. Piatsiushyk and V. Romanenkov, Loop heat pipe for cooling of high-power electronic components, International Journal of Heat and Mass Transfer, 52 (2009) 301–308.

    Article  Google Scholar 

  9. Z. Ming, L. Zhongliang and M. Guoyuan, The experimental and numerical investigation of a grooved vapor chamber, Applied Thermal Engineering, 29 (2009) 422–430.

    Article  Google Scholar 

  10. J. H. Boo and E. G. Jung, Bypass line assisted start-up of a loop heat pipe with a flat evaporator, Journal of Mechanical Science and Technology, 23 (2009) 1613–1619.

    Article  Google Scholar 

  11. T. K. Lim and S. H. Rhi, Experimental study on nanofludic heat pipe hot chuck plate in semiconductor wafer baking process, Journal of Mechanical Science and Technology, 24 (2010) 1501–1509.

    Article  Google Scholar 

  12. T. H. Wang, C. C. Lee and Y. S. Lai, Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader, Microelectronic Engineering, 87 (2010) 2463–2467.

    Article  Google Scholar 

  13. H. Y. Li, M. H. Chiang, C. I. Lee and W. J. Yang, Thermal performance of plate-fin vapor chamber heat sinks, Int. J. Heat Mass Transfer, 37 (2010) 731–738.

    Article  Google Scholar 

  14. S. C. Wong, K. C. Hsieh, J. D. Wu and W. L. Han, A novel vapor chamber and its performance, International Journal of Heat and Mass Transfer, 53 (2010) 2377–2384.

    Article  Google Scholar 

  15. J. C. Wang, R. T. Wang, T. L. Chang and D. S. Hwang, Development of 30 Watt high-power LEDs vapor chamber-based plate, International Journal of Heat and Mass Transfer, 53 (2010) 3990–4001.

    Article  Google Scholar 

  16. T. E. Tsai, H. H. Wu, C. C. Chang and S. L. Chen, Twophase closed thermosyphon vapor-chamber system for electronic cooling, International Communications in Heat and Mass Transfer, 37 (2010) 484–489.

    Article  Google Scholar 

  17. S. Harmand, R. Sonan, M. Fakès and H. Hassan, Transient cooling of electronic components by flat heat pipes, Applied Thermal Engineering, 31 (2011) 1877–1885.

    Article  Google Scholar 

  18. S. C. Wong, S. F. Huang and K. C. Hsieh, Performance tests on a novel vapor chamber, Applied Thermal Engineering, 31 (2011) 1757–1762.

    Article  Google Scholar 

  19. H. Y. Li and M. H. Chiang, Effects of shield on thermalfluid performance of vapor chamber heat sink, International Journal of Heat and Mass Transfer, 54 (2011) 1410–1419.

    Article  Google Scholar 

  20. M. Crepinsek and C. Park, Experimental analysis of pump-assisted and capillary-driven dual-evaporators twophase cooling loop, Applied Thermal Engineering, 38 (2012) 133–142.

    Article  Google Scholar 

  21. A. A. A. Attia and B. T. A. El-Assal, Experimental investigation of vapor chamber with different working fluids at different charge ratios, Ain Shams Engineering Journal, 3 (2012) 289–297.

    Article  Google Scholar 

  22. X. Ji, J. Xu and A. M. Abanda, Copper foam based vapor chamber for high heat flux dissipation, Experimental Thermal and Fluid Science, 40 (2012) 93–102.

    Article  Google Scholar 

  23. X. Ji, J. Xu, A. M. Abanda and Q. Xue, A vapor chamber using extended condenser concept for ultra-high heat flux and large heater area, International Journal of Heat and Mass Transfer, 55 (2012) 4908–4913.

    Article  Google Scholar 

  24. J. Choi, M. Jeong, J. Yoo and M. Seo, A new CPU cooler design based on an active cooling heatsink combined with heat pipes, Applied Thermal Engineering, 44 (2012) 50–56.

    Article  Google Scholar 

  25. M. Reyes, D. Alonso, J. R. Arias and A. Velazquez, Experimental and theoretical study of a vapour chamber based heat spreader for avionics applications, Applied Thermal Engineering, 37 (2012) 51–59.

    Article  Google Scholar 

  26. Y. T. Chen, S. W. Kang, Y. H. Hung, C. H. Huang and K. C. Chien, Feasibility study of an aluminum vapor chamber with radial grooved and sintered powders wick structures, Applied Thermal Engineering, 51 (2013) 864–870.

    Article  Google Scholar 

  27. Y. Peng, W. Liu, N. Wang, Y. Tian and X. Chen, A novel wick structure of vapor chamber based on the fractal architecture of leaf vein, International Journal of Heat and Mass Transfer, 63 (2013) 120–133.

    Article  Google Scholar 

  28. H. Hassan and S. Harmand, 3D transient model of vapour chamber: Effect of nanofluids on its Performance, Applied Thermal Engineering, 51 (2013) 1191–1201.

    Article  Google Scholar 

  29. H. Peng, J. Li and X. Ling, Study on heat transfer performance of an aluminum flat plate heat pipe with fins in vapor chamber, Energy Conversion and Management, 74 (2013) 44–50.

    Article  Google Scholar 

  30. M. C. Tsai, S. W. Kang and K. V. de Paiva, Experimental studies of thermal resistance in a vapor chamber heat spreader, Applied Thermal Engineering, 51 (2013) 1191–1201.

    Article  Google Scholar 

  31. B. Xiao and A. Faghri, A three-dimensional thermal-fluid analysis of flat heat pipes, International Journal of Heat and Mass Transfer, 51 (2008) 3113–3126.

    Article  MATH  Google Scholar 

  32. J. M. Towwier and M. S. Elgnr, A heat pipe transient analysis model, International Journal of Heat and Mass Transfer, 37 (1994) 753–762.

    Article  Google Scholar 

  33. I. W. Eames, N. J. Marr and H. Sabir, The evaporation coefficient of water: a review, International Journal of Heat and Mass Transfer, 40 (1997) 2963–2973.

    Article  MATH  Google Scholar 

  34. A. Faghri, Heat pipe science and technology, Talor and Francis, Wasgington, DC, USA (1995).

    Google Scholar 

  35. Y. L. Tsay, T. F. Lin and W. M. Yan, Cooling of falling liquid film through interfacial heat and mass transfer, Journal of Multiple Flow, 16 (1990) 853–865.

    Article  MATH  Google Scholar 

  36. J. P. Van Doormal and G. D. Raithby, Enhancements of the SIMPLEC method for predicting incompressible fluid flows, Numerical Heat Transfer, 7 (1984) 147–163.

    Article  Google Scholar 

Download references

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Correspondence to Paisarn Naphon.

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Recommended by Associate Editor Dae Hee Lee

P. Naphon was born in Thailand on July 28, 1972. He received the Master D., and Dr.Ing. degrees in mechanical engineering from King Mongkut’s University of Technology Thonburi, Bangkok, Thailand, in 1998 and 2004, respectively. His areas of interest include heat transfer enhancement, heat pipe testing, modeling and simulation, electronic cooling and heat transfer enhancement. He has a temporary contract now with Srinakharinwirot University - Bangkok-Thailand.

S. Wiriyasart was born in Thailand on April 13, 1982. He received the Bachelor’s and Master’s degrees in mechanical engineering from Srinakharinwirot University, Bangkok, Thailand, in 2006, 2008, respectively. His areas of interest include heat transfer enhancement, heat pipe testing, modeling and simulation, electronic cooling. Now, he is the Ph.D. student in Mechanical Engineering, Srinakharinwirot University - Bangkok-Thailand.

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Wiriyasart, S., Naphon, P. Effect of heat source area on the thermal resistance of the wick columns vapor chambers. J Mech Sci Technol 30, 933–942 (2016). https://doi.org/10.1007/s12206-016-0147-0

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  • DOI: https://doi.org/10.1007/s12206-016-0147-0

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