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A Study of the Creep Properties and Constitutive Model of Sintered Nano-silver: Role of Loading Condition and Temperature

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Abstract

Sintered nano-silver is a potential packaging material for third-generation semiconductors. In the current work, the creep evolution of sintered nano-silver under different loading conditions was studied theoretically. A damage creep model was established for the prediction of creep evolution and damage accumulation, and the accuracy of the model was verified by comparing it with the experimental data of compression and tensile and shear creep. In addition, a porosity model has been proposed based on the damage evolution of sintered nano-silver for tensile creep. For compression creep, the experiments and theoretical studies were performed to supplement the lack of compression creep of sintered nano-silver, and the porous microstructure and failure mechanism were elaborated.

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Acknowledgements

The authors would like to acknowledge the financial support by the Shaanxi science and technology innovation team (No. 2022TD-05), Shaanxi “Sanqin Scholar” innovation team, the major basic research project of the natural science foundation of the Jiangsu higher education institutions of China (No. 22KJB130006) and Natural science foundation of Jiangsu province and Changzhou leading innovative talent introduction and cultivation project (No. CQ20220101).

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Authors and Affiliations

  1. School of Civil Engineering and Architecture, Changzhou Institute of Technology, Changzhou, 213002, China

    Gong He & Song Yang

  2. Industrial College of Carbon Fiber and New Materials, Changzhou Institute of Technology, Changzhou, 213002, China

    Gong He

  3. School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, 710072, China

    Gong He, Chen Xiangchen, Deng Zichen & Yao Yao

  4. School of Civil Engineering, Xi’an University of Architecture and Technology, Xi’an, 710055, China

    Yao Yao

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  1. Gong He
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Contributions

YY, DZ and GH proposed the idea, CX and SY performed compression experiments, GH derived theories, analyzed experimental data and wrote the manuscript. All the authors discussed the results and contributed to the preparation of the manuscript.

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Correspondence to Deng Zichen or Yao Yao.

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He, G., Xiangchen, C., Yang, S. et al. A Study of the Creep Properties and Constitutive Model of Sintered Nano-silver: Role of Loading Condition and Temperature. JOM 75, 3859–3869 (2023). https://doi.org/10.1007/s11837-023-05981-6

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