Abstract
The currently available heat-sink materials cannot meet the requirements for the 5G and beyond technology. Copper (Cu)/diamond composites have been proposed because Cu and diamond are excellent thermal conductors, while diamond has a very low coefficient of thermal expansion. Mixing Cu and diamond to form a composite seems a straightforward approach. However, this simple approach has never succeeded because, chemically, Cu does not wet diamond. Therefore the Cu-diamond interface cannot be tightly bonded, leading to an inferior thermal conductivity. This study presents a modified press and sinter process for depositing Cu submicronic particles onto diamond reinforcements prior to densification by hot pressing. The initial results obtained from microstructural observations and x-ray photoelectron spectroscopy have shown that our strategy can lead to successful Cu deposition onto diamond particles. The Cu deposition leads to a well-bonded interface between the copper matrix and diamond reinforcement, ultimately resulting in excellent thermal conductivity.
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This research was financially supported by the University of Auckland through the Faculty Research Development Fund (FRDF) Programme (Contract No. 3717129).
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Hayat, M.D., Singh, H., Karumbaiah, K.M. et al. Enhanced Interfacial Bonding in Copper/Diamond Composites via Deposition of Nano-copper on Diamond Particles. JOM 74, 949–953 (2022). https://doi.org/10.1007/s11837-021-05054-6
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DOI: https://doi.org/10.1007/s11837-021-05054-6