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Effect of Weld Temperature on Microstructure and Properties of TM52/Q235 Transient Liquid Phase Diffusion-Bonded Joint

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Abstract

TM52/Q235 dissimilar materials were welded by transient liquid phase diffusion bonding (TLP) with BNi2 foil. The effects of welding temperature on the interface structure, mechanical properties, electrochemical properties and corrosion surface morphology of joints were studied. At the same time, the connection mechanism of TM52/Q235 welded joint is established. The results show that TM52/Q235 can achieve good metallurgical bonding. When the welding temperature is 1100 °C, the shear strength of the joint is the largest, reaching 425.06 MPa. And the shear fracture shows obvious ductile fracture characteristics, and the failure is located at the side of TM52. With the increase in welding temperature, the corrosion resistance of joints increases at first and then decreases. Especially at 1100 °C, the passivation film formed at the weld is the densest and the corrosion rate is the lowest. And the electrochemical corrosion products are mainly composed of Fe2O3, Fe3O4 and FeOOH.

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Funding

This research was supported by National Natural Science Foundation of China (No.51704255).

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Authors and Affiliations

  1. School of New Energy and Materials, Southwest Petroleum University, Chengdu, 610500, People’s Republic of China

    Bensheng Huang, Jinsong Chen, Lei Zhang & Yanqiu Wu

  2. Energy Equipment Institute, Southwest Petroleum University, Chengdu, 610500, Sichuan, People’s Republic of China

    Bensheng Huang, Jinsong Chen, Lei Zhang & Yanqiu Wu

  3. Texas Instruments Semiconductor Manufacturing (Chengdu) Co., Ltd., Chengdu, 611731, People’s Republic of China

    Jinsong Chen

  4. Erzhong(Deyang)Heavy Equipment Co., Ltd., Deyang, 618099, People’s Republic of China

    Jianneng Zheng

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  1. Bensheng Huang
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Correspondence to Bensheng Huang.

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Huang, B., Chen, J., Zhang, L. et al. Effect of Weld Temperature on Microstructure and Properties of TM52/Q235 Transient Liquid Phase Diffusion-Bonded Joint. J. of Materi Eng and Perform 32, 7456–7467 (2023). https://doi.org/10.1007/s11665-022-07615-5

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