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Effect of Interfacial Microstructure on Mechanical Properties of Cold Pressure-Welded Al-Cu Joints Subjected to Annealing

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Abstract

We developed a cold pressure-welding process for manufacturing Al-Cu plate butt joints and investigated the relationship between the interfacial microstructure and tensile properties. In the as-welded state, the grain sizes of Al and Cu were refined compared to those before welding. CuAl2 of thickness less than 150 nm was present at the interfacial layer, and Al and Cu were bonded via CuAl2. When the welded joint was annealed at 773 K for 7.2 ks, the total thickness of the intermetallic compound (IMC) layers increased with annealing temperature; layers of CuAl2 and mixed Al2Cu3+Al4Cu9+AlCu3 were formed from the Al side toward Cu. Interfacial fractures were confirmed in some welded joints when the total IMC layer thickness exceeded 4.3 μm; these fractures were observed at the Al-CuAl2 boundary. The growth of the IMC layers was dependent on the diffusion mechanism, and the calculated apparent activation energy was 99.7 kJ/mol.

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Data Availability

All data are available from the corresponding author on reasonable request.

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Acknowledgment

This work was financially supported by the Innovative Energy Conservation Technology Innovation Program of New Energy and Industrial Technology Development Organization (NEDO) (Grant Number 19101868-0). We would also like to thank Editage (wwweditage.com) for English language editing.

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Authors and Affiliations

  1. Department of Physical Science and Materials Engineering, Faculty of Science and Engineering, Iwate University, 4-3-5 Ueda, Morioka, Iwate, 020-8551, Japan

    Satoru Nishikawa & Takara Arayashiki

  2. Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka,, Ibaraki, Osaka, 567-0047, Japan

    Makoto Takahashi

  3. Aster Co., Ltd, 12-3, Yanagida, Yokote, Akita, 013-0054, Japan

    Jun Chiba, Masahito Nogami & Takenobu Hongo

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  1. Satoru Nishikawa
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  2. Takara Arayashiki
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Correspondence to Satoru Nishikawa.

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Nishikawa, S., Arayashiki, T., Takahashi, M. et al. Effect of Interfacial Microstructure on Mechanical Properties of Cold Pressure-Welded Al-Cu Joints Subjected to Annealing. J. of Materi Eng and Perform 30, 7386–7396 (2021). https://doi.org/10.1007/s11665-021-05970-3

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  • DOI: https://doi.org/10.1007/s11665-021-05970-3

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