Abstract
The exposure of miniaturized components to the environment leads to new failure analysis as a result of environmental conditions and constant innovation of the component materials and dimensions. Generally, these failures occur on the solder joints, which ensure the mechanical and electrical connection between the printed circuit board and the component. Conformal coating is a thin layer of a polymeric material that encapsulates the components and consequently their solder joints to protect against harsh environments. However, this application is not recommended in some components such as ball grid array and quad flat no-lead (QFN) packages, since it can reduce the reliability of the solder joints when exposed to temperature fluctuations. Therefore, by using a finite element analysis, a thermal cycle test was simulated with and without conformal coating. The simulation output was extrapolated to lifetime theoretical methods with the aim of predicting the number of cycles until the failure of the solder joints. Therefore, this study demonstrates that for both components without conformal coating, solder joint lifetime was a precise approximation. Coated solder joints reveal a drastic reduction in their reliability due to the influence of the conformal coating behavior and its thermomechanical properties.
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References
N. Jiang et al., Reliability issues of lead-free solder joints in electronic devices Sci. Technol. Adv. Mater. 20, 876–901 (2019). https://doi.org/10.1080/14686996.2019.1640072.
R.S. Khandpur, Printed Circuit Boards, Vol. 71 (McGraw-Hill Handbooks, 1992).
D.S. Steinberg, Vibration Analysis for Electronic Equipment (Wiley, 1988, 2000).
J.W. Kim, Y.C. Lee, S.S. Ha, and S.B. Jung, Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test J. Mater. Sci. Mater. Electron. 20, 17–24 (2009). https://doi.org/10.1007/s10854-008-9588-2.
J.A. Depiver, S. Mallik, and D. Harmanto, Solder joint failures under thermo-mechanical loading conditions–a review Adv. Mater. Process. Technol. (2020). https://doi.org/10.1080/2374068X.2020.1751514.
K. Kokko, L. Frisk, and P. Heino, Thermal cycling of flip chips on FR-4 and PI substrates with parylene C coating Solder. Surf. Mt. Technol. 22, 42–48 (2010). https://doi.org/10.1108/09540911011054181.
F.J. Mcgarry, Analysis and improvements of an acrylic conformal coating process by analysis and improvements of an acrylic conformal coating process, 1997.
A. Thornton, Conformal coatings for pacemaker applications NBS Spec. Publ. 400, 109–113 (1979).
IPC-CC-830C, Qualification and performance of electrical insulating compound for printed wiring assemblies, IPC, Bannockburn, Illinois, 2018.
C. Yin, S. Stoyanov, C. Bailey, and P. Stewart, Thermomechanical analysis of conformally coated QFNs for high-reliability applications IEEE Trans. Comp. Packag. Manuf. Technol. 9, 2210–2218 (2019). https://doi.org/10.1109/TCPMT.2019.2925874.
A.-A. Abbas, G. Pandiarajan, S. Iyer, C. Greene, D. Santos, and K. Srihari, Impact of conformal coating material on the long-term reliability of ball grid array solder joints IEEE Trans. Comp. Packag. Manuf. Technol. 3950, 1 (2020). https://doi.org/10.1109/tcpmt.2020.3027635.
C. Yin, S. Stoyanov, C. Bailey, and P. Stewart, Modelling the impact of conformal coating penetration on QFN reliability, in 18th Int. Conf. Electron. Packag. Technol. ICEPT 2017, pp. 1021–1026, 2017, https://doi.org/10.1109/ICEPT.2017.8046616.
M. Serebreni, R. Wilcoxon, D. Hillman, N. Blattau, and C. Hillman, The effect of improper conformal coating on SnPb and Pb-free BGA solder joints during thermal cycling: experiments and modelling Annu. IEEE Semicond. Therm. Meas. Manag. Symp. (2017). https://doi.org/10.1109/SEMI-THERM.2017.7896906.
G. Sharon, and G. Caswell, Temperature cycling and fatigue in electronics Adv. Microelectron. 42, 18–24 (2015).
D. Frear, Solder Joint Reliability (Elsevier, 2001).
C. Wang, Y. Zhu, X. Li, and R. Gao, Low cycle fatigue behavior of SnAgCu solder joints Xiyou Jinshu Cailiao Yu Gongcheng/Rare Met Mater. Eng. 45, 829–835 (2016). https://doi.org/10.1016/s1875-5372(16)30083-2.
H.B. Qin, X.P. Zhang, M.B. Zhou, X.P. Li, and Y.W. Mai, Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints Microelectron. Reliab. 55, 1214–1225 (2015). https://doi.org/10.1016/j.microrel.2015.05.013.
Bosch Car Multimédia, “Confidential Report.”
M. Serebreni and N. Blattau, Effect of encapsulation materials on tensile stress during thermo-mechanical cycling of Pb-free solder joints effect of encapsulation materials on tensile stress during thermo-mechanical, 2017.
B.A. Zahn, Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package.
H. Hamdani, B. Radi, and A. Elhami, Submodeling technique for assessment and numerical prediction of solder jointsfailuresin mechatronic devices, vol. 2017, no. Limmii, pp. 13–15, 2017.
ANSYS Inc., “Workbench User’s Guide,” ANSYS Man., vol. 15317, no. Release 15.0, pp. 724–746, 2013, [Online]. Available: http://148.204.81.206/Ansys/readme.html.
ANSYS Inc., Structural User’s Guide. 2015.
M.N. Tamin, Y.B. Liew, A.N.R. Wagiman, and W.K. Loh, Solder joint fatigue in a surface mount assembly subjected to mechanical loading IEEE Trans. Comp. Packag. Technol. 30, 824–829 (2007). https://doi.org/10.1109/TCAPT.2007.906297.
V. Vasudevan and X. Fan, An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling, in Proc. Electron. Components Technol. Conf., no. September 2014, pp. 139–145, 2008, https://doi.org/10.1109/ECTC.2008.4549960.
J. Clech, The combined effect of assembly pitch and distance to neutral point on solder joint thermal cycling life, in Proceedings of SMTA International, September 25–29 (Rosemont, IL, 2016), p. 88.
Funding
This work was supported through the R&D Units Project Scope: UIDB/00319/2020, UIDB/04077/2020, UIDB/04436/2020, and Bosch Car Multimedia.
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Vieira, D.N., Lima, A., Santos, D. et al. Prediction of Solder Joint Reliability with Applied Acrylic Conformal Coating. J. Electron. Mater. 51, 273–283 (2022). https://doi.org/10.1007/s11664-021-09232-9
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DOI: https://doi.org/10.1007/s11664-021-09232-9