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Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

  • TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder
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Abstract

The interfacial reactions between lead-free solders Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-9 wt.% Zn (SZ), and Cu-2.0 wt.% Be (Alloy 25) were investigated using the liquid/solid couple technique. The couples were reacted at 240–270°C for 0.5–10 h. The results revealed that only the scallop-shaped (Cu, Be)6Sn5 phase was formed at 240°C for 0.5–2 h in the Sn/Alloy 25 couple. At a longer time (> 4 h) or higher temperature (255°C and 270°C), the (Cu, Be)3Sn phase was observed at the interface. In the SAC/Alloy 25 couple, the results were similar to that in the Sn/Alloy 25 couples. Only the scallop-shaped (Cu, Be, Ag)6Sn5 phase was formed for the short reaction time or at lower reaction temperature. With increasing reaction times and temperatures, both the (Cu, Be, Ag)6Sn5 and (Cu, Be, Ag)3Sn phases were observed at the SAC/Alloy 25 interface. In the SZ/Alloy 25 couple, the (Cu, Sn)Zn5 and (Cu, Sn)5Zn8 phases were observed. Of these three couples, the intermetallic compound (IMC) thickness obeyed the parabolic law, and the IMC growth mechanism was diffusion-controlled.

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References

  1. K. Zeng, R. Stierman, T.C. Chiu, and D. Edwards, J. Appl. Phys. 97, 024508 (2005).

    Article  CAS  Google Scholar 

  2. Y.K. Jee, Y.H. Ko, and J. Yu, J. Mater. Res. 22, 1879 (2007).

    Article  CAS  Google Scholar 

  3. A. Rahn, The Basics of Soldering (New York: Wiley, 1993).

    Google Scholar 

  4. T. Liu, D. Kim, D. Leung, M.A. Korhonen, and C.Y. Li, Scr. Mater. 35, 65 (1996).

    Article  Google Scholar 

  5. K.N. Tu, Mater. Chem. Phys. 46, 217 (1996).

    Article  CAS  Google Scholar 

  6. A. Hayashi, C.R. Kao, and Y.A. Chang, Scr. Mater. 37, 393 (1997).

    Article  CAS  Google Scholar 

  7. K. Suganuma, K. Niihara, T. Shoutoku, and Y. Nakamura, J. Mater. Res. 13, 2859 (1998).

    Article  CAS  Google Scholar 

  8. C.M. Chuang and K.L. Lin, J. Electron. Mater. 32, 1426 (2003).

    Article  CAS  Google Scholar 

  9. K.S. Kim, S.H. Huh, and K. Suganuma, J. Alloys Compd. 352, 226 (2003).

    Article  CAS  Google Scholar 

  10. R.A. Gagliano and M.E. Fine, J. Electron. Mater. 32, 1441 (2003).

    Article  CAS  Google Scholar 

  11. A. Hirose, H. Yanagawa, E.I. Kojiro, and F. Kobayashi, Sci. Technol. Adv. Mater. 5, 267 (2004).

    Article  CAS  Google Scholar 

  12. H.M. Wu, M.D. Cheng, S.Y. Chang, and S.F. Yen, J. Electron. Mater. 33, 22 (2004).

    Article  CAS  Google Scholar 

  13. D.Q. Yu, H.P. Xie, and L. Wang, J. Alloys Compd. 385, 119 (2004).

    Article  CAS  Google Scholar 

  14. M.N. Islam, Y.C. Chan, M.J. Rizvi, and W. Jillek, J. Alloys Compd. 400, 136 (2005).

    Article  CAS  Google Scholar 

  15. C.Y. Chou, S.W. Chen, and Y.S. Chang, J. Mater. Res. 21, 1849 (2006).

    Article  CAS  Google Scholar 

  16. J.W. Yoon and S.B. Jung, J. Alloys Compd. 407, 141 (2006).

    Article  CAS  Google Scholar 

  17. W. Peng, E. Monlevade, and M.E. Marques, Microelectron. Reliab. 47, 2161 (2007).

    Article  CAS  Google Scholar 

  18. C.M. Chen, C.H. Chen, C.P. Lin, and W.C. Su, J. Electron. Mater. 37, 1605 (2008).

    Article  CAS  Google Scholar 

  19. Y.M. Kim, H.R. Roh, S. Kim, and Y.H. Kim, J. Electron. Mater. 39, 2504 (2010).

    Article  CAS  Google Scholar 

  20. W.Y. Chen, C.Y. Yu, and J.G. Duh, J. Mater. Sci. 47, 4012 (2012).

    Article  CAS  Google Scholar 

  21. D. Li, P. Franke, S. Fürtauer, D. Cupid, and H. Flandorfer, Intermetallics 34, 148 (2013).

    Article  CAS  Google Scholar 

  22. Y.W. Yen, W.T. Chou, Y. Tseng, C. Lee, and C.L. Hsu, J. Electron. Mater. 37, 73 (2008).

    Article  CAS  Google Scholar 

  23. Y.W. Yen, P.H. Tsai, Y.K. Fang, S.C. Lo, Y.P. Hsieh, and C. Lee, J. Alloys Compd. 503, 25 (2010).

    Article  CAS  Google Scholar 

  24. Y.W. Yen, P.H. Tsai, Y.K. Fang, B.J. Chen, and C. Lee, J. Alloys Compd. 517, 111 (2012).

    Article  CAS  Google Scholar 

  25. Y.W. Yen, Y.P. Hsieh, C.C. Jao, C.W. Chiu, and Y.S. Li, J. Electron. Mater. 43, 187 (2014).

    Article  CAS  Google Scholar 

  26. W.K. Liou and Y.W. Yen, Intermetallics 17, 72 (2009).

    Article  CAS  Google Scholar 

  27. Y.W. Yen, C.W. Chiu, C.M. Chen, M.T. Lai, and J.Y. Dai, J. Electron. Mater. 44, 909 (2015).

    Article  CAS  Google Scholar 

  28. Y.W. Yen, C.Y. Lin, G.N. Hermana, P.Y. Chen, and Y.P. Wu, J. Alloys Compd. 710, 479 (2017).

    Article  CAS  Google Scholar 

  29. S.K. Lin, K.D. Chen, H. Chen, W.K. Liou, and Y.W. Yen, J. Mater. Res. 25, 2278 (2010).

    Article  CAS  Google Scholar 

  30. G.D. Chen and Y.W. Yen, Master’s thesis (2013).

  31. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 31, 584 (2012).

    Article  Google Scholar 

  32. Y.W. Yen, A.D. Laksono, and C.Y. Yang, Microelectron. Reliab. 96, 29 (2019).

    Article  CAS  Google Scholar 

  33. G. Zeng, S.B. Xue, L. Zhang, L.L. Gao, W. Dai, and J.D. Luo, J. Mater. Sci.: Mater. Electron. 21, 421 (2010).

    CAS  Google Scholar 

  34. L.C. Tsao, J. Alloys Compd. 509, 8441 (2011).

    Article  CAS  Google Scholar 

  35. A.P. Miodownik, Phase Diagrams of Binary Copper Alloys, ed. P.R. Subramanian, D.J. Chakrabarti, and D.E. Laughlin (Materials Park: ASM International, 1994), p. 487.

    Google Scholar 

  36. C.Y. Chou and S.W. Chen, Acta Mater. 54, 2393 (2006).

    Article  CAS  Google Scholar 

  37. K.L. Lin, J.M. Song, and C.W. Huang, J. Chin. Colloid Interface Soc. 26, 61 (2004).

    Google Scholar 

  38. H. Hao, Y. Shi, Z. Xia, Y. Lei, and F. Guo, J. Electron. Mater. 37, 2 (2008).

    Article  CAS  Google Scholar 

  39. Q.Q. Li, Y.C. Chan, K.L. Zhang, and K.C. Yung, Microelectron. Eng. 122, 52 (2014).

    Article  CAS  Google Scholar 

  40. M. Date, K.N. Tu, T. Shoji, M. Fujiyoshi, and K. Sato, J. Mater. Res. 19, 2887 (2004).

    Article  CAS  Google Scholar 

  41. Y. Yuan, Y.Y. Guan, D.J. Li, and N. Moelans, J. Alloys Compd. 661, 282 (2016).

    Article  CAS  Google Scholar 

  42. S.Y. Chang, L.C. Tsao, M.W. Wu, and C.W. Chen, J. Mater. Sci.: Mater. Electron. 23, 100 (2012).

    CAS  Google Scholar 

  43. C.S. Lee and F.S. Shieu, J. Electron. Mater. 35, 1660 (2006).

    Article  CAS  Google Scholar 

Download references

Acknowledgments

The authors acknowledge the financial support from the Ministry of Science and Technology, Taiwan, R.O.C. (MOST 108-2221-E-011-091), the Applied Research Center for Thin-Film Metallic Glass from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan. The author is also thankful for the help from Mr. S. C. Laiw who works at the National Taiwan University of Science and Technology for the SEM–EDS operation, Mr. C. Y. Kao who works at the National Taiwan University, and Miss Tsai who works at the National Tsing Hua University for carrying out the EPMA analysis.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, 10672, Taiwan, R.O.C.

    Yu-Chun Li, Ching-Hsun Chang & Yee-Wen Yen

  2. School of Engineering, University of San Carlos (USC), Cebu City, Philippines

    Alberto S. Pasana

  3. Institute of Nuclear Energy Research, Taoyüan, 32546, Taiwan, R.O.C.

    Hsien-Ming Hsiao

  4. Applied Research Center for Thin-Film Metallic Glass, National Taiwan University of Science and Technology, Taipei, 10607, Taiwan, R.O.C.

    Yee-Wen Yen

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  1. Yu-Chun Li
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Li, YC., Chang, CH., Pasana, A.S. et al. Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples. J. Electron. Mater. 50, 903–913 (2021). https://doi.org/10.1007/s11664-020-08693-8

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  • DOI: https://doi.org/10.1007/s11664-020-08693-8

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