Abstract
The effect of Zn addition on the evolution of IMC at near-eutectic 50In-50Sn/Cu interfaces was investigated at 210°C. In 50In-(50-x)Sn-xZn/Cu(x = 0, 6) diffusion couples, two types of intermetallic compound layers were observed: ε-Cu3(In,Sn) adjacent to the Cu substrate and η-Cu2(In,Sn) adjacent to the solder, which were formed though a solid–solid diffusion reaction and solid–liquid reaction, respectively. The growth of ε-Cu3(In,Sn) was at the expense of η-Cu2(In,Sn). In 50In-44Sn-6Zn/Cu diffusion couple, the growth of ε-Cu3(In,Sn) was grain-boundary diffusion controlled and n (the time constant) was 0.31. But in the 50In-50Sn/Cu diffusion couple, due to the slow growth of η-Cu2(In,Sn), the time constant of ε-Cu3(In,Sn) was down to 0.19. With the addition of Zn in the 50In-50Sn/Cu couple, the diffusion of Cu was alleviated. Zn exhibited high activity and moderated the dissipation of the main atoms (In/Sn) in the solder. So the growth of Cu3(In,Sn) was suppressed significantly.
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References
Y. Li, F. Wu, and Y.C. Chan, J. Mater. Sci. Mater. Electron. 26, 8522 (2015).
S.K. Lin, R.B. Chang, S.W. Chen, M.Y. Tsai, and C.M. Hsu, J. Mater. Sci. 49, 3805 (2014).
G. Yoo and J.H. Park, J. Korean Phys. Soc. 65, 960 (2014).
X. Liu, R.W. Davis, L.C. Hughes, M.H. Rasmussen, R. Bhat, C.E. Zah, and J. Stradling, J. Appl. Phys. 100, 013104 (2006).
J.C. Leong, L.C. Tsao, C.J. Fang, and C.P. Chu, J. Mater. Sci. Mater. Electron. 22, 1443 (2011).
S.Y. Chang, L.C. Tsao, M.W. Wu, and C.W. Chen, J. Mater. Sci. Mater. Electron. 23, 100 (2011).
J. Pstruś, T. Gancarz, and P. Fima, Adv. Mater. Sci. Eng. 2017, 1 (2017).
Y.K. Jee, Y.H. Ko, and J. Yu, J. Mater. Res. 22, 1879 (2007).
T. Xu, X. Hu, Y. Li, and X. Jiang, J. Mater. Sci. Mater. Electron. 28, 18515 (2017).
S. Sommadossi, W. Gust, and E.J. Mittemeijer, Mater. Chem. Phys. 77, 924 (2002).
Y. Yao, J. Zhou, F. Xue, and X. Chen, J. Alloy Compd. 682, 627 (2016).
C.H. Wang and K.T. Li, Mater. Chem. Phys. 164, 223 (2015).
P. Šebo, Z. Moser, P. Švec, D. Janičkovič, E. Dobročka, W. Gasior, and J. Pstru, J. Alloy Compd. 480, 409 (2009).
T.H. Chuang, C.L. Yu, S.Y. Chang, and S.S. Wang, J. Electron. Mater. 31, 640 (2002).
D.G. Kim and S.B. Jung, J. Alloy Compd. 386, 151 (2005).
S.K. Lin, T.Y. Chung, S.W. Chen, and C.H. Chang, J. Mater. Res. 24, 2628 (2009).
S.K. Lin, C.F. Yang, S.H. Wu, and S.W. Chen, J. Electron. Mater. 37, 498 (2008).
Y. Tang, S.M. Luo, Z.H. Li, C.J. Hou, and G.Y. Li, J. Electron. Mater. 47, 5913 (2018).
R.A. Gagliano and M.E. Fine, JOM-US 53, 33 (2001).
K. Kanlayasiri and K. Sukpimai, J. Alloy Compd. 668, 169 (2016).
D.L. Wang, Y. Yuan, and L. Luo, J. Mater. Sci. Mater. Electron. 23, 61 (2011).
L.P. Mo, F.S. Wu, C.Q. Liu, in 2015 IEEE 65th Electronic Components and Technology Conference (2015), pp. 1854–1858.
D. Sarwono and K.L. Lin, J. Electron. Mater. 48, 99 (2018).
C.H. Wang and C.Y. Kuo, Mater. Chem. Phys. 130, 651 (2011).
S.K. Kang, D. Leonard, D.Y. Shih, L. Gignac, D.W. Henderson, S. Cho, and J. Yu, J. Electron. Mater. 35, 479 (2006).
Acknowledgments
The authors would like to acknowledge the financial support provided by the Harbin Youth Reserve Talents Project [Grant Number RC2014QN017012]. The authors would like to thank Professor Chen and Professor Ma at the center for material analysis and testing, who provided experimental help.
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Wang, J., Mao, D., Chen, H. et al. Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces. J. Electron. Mater. 49, 1512–1517 (2020). https://doi.org/10.1007/s11664-019-07838-8
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DOI: https://doi.org/10.1007/s11664-019-07838-8