Abstract
The correlations between different Ni contents in Sn-1.2Ag-0.5Cu-xNi (wt.%; x = 0, 0.05, 0.1)/organic solderability preservative Cu solder joints and shear test performance before and after aging were probed. With the aid of electron back scattering diffraction analysis and a scanning electron microscope, complexity in microstructure of Ni-doped solder joints was investigated. The results of a slow speed shear test revealed that the peak force of solder joints was efficiently enhanced by the addition of Ni before and after aging. The improvement of mechanical strength was ascribed to the modification of microstructure by the introduction of minor Ni addition. Spread and tiny intermetallic compounds, and the oriented interlaced structure in Ni-doped solder joints acted as hindrances for propagation of cracks and dislocations. It is revealed that solder joints with minor Ni doping tend to exhibit better mechanical reliability in advanced electronic packaging no matter before or after aging.
Similar content being viewed by others
References
K.N. Tu and K. Zeng, in Electronic Components & Technology Conference Proceedings (2002), pp. 1194–1200.
F.X. Che, W.H. Zhu, E.S.W. Poh, X.W. Zhang, and X.R. Zhang, J. Alloys Compd. 507, 215–224 (2010).
F. Cheng, F. Gao, J. Zhang, W. Jin, and X. Xiao, J. Mater. Sci. 46, 3424–3429 (2011).
P.L.A.F. Guo, in Electronics Packaging Technology Conference Proceedings (2006), pp. 717–721.
A.I.E., Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications. In: Lead-Free Electronic Solders. (Springer, Boston, MA, 2006), pp. 55–76.
A.A. El-Daly, A.E. Hammad, A. Fawzy, and D.A. Nasrallh, Mater. Des. 43, 40 (2013).
P. Liu, P. Yao, and J. Liu, J. Alloys Compd. 486, 474 (2009).
C.-Y. Yu, T.-K. Lee, M. Tsai, K.-C. Liu, and J.-G. Duh, J. Electron. Mater. 39, 2544 (2010).
C. Fleshman, W.-Y. Chen, T.-T. Chou, J.-H. Huang, and J.-G. Duh, Mater. Chem. Phys. 189, 76 (2017).
R. Kinyanjui, L.P. Lehman, L. Zavalij, and E. Cotts, J. Mater. Res. 20, 2914 (2011).
B.S.S. Chandra Rao, J. Weng, L. Shen, T.K. Lee, and K.Y. Zeng, Microelectron. Eng. 87, 2416 (2010).
K.E. Yazzie, H.X. Xie, J.J. Williams, and N. Chawla, Scripta Mater. 66, 586 (2012).
B. Arfaei, N. Kim, and E.J. Cotts, J. Electron. Mater. 41, 362 (2011).
L.P. Lehman, Y. Xing, T.R. Bieler, and E.J. Cotts, Acta Mater. 58, 3546 (2010).
Acknowledgments
The financial support from the Ministry of Science and Technology, Taiwan, under the Contract No. MOST 107-2221-E-007-090 and technical support from Shenmao are much appreciated.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Fleshman, C., Duh, JG. The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging. J. Electron. Mater. 49, 196–201 (2020). https://doi.org/10.1007/s11664-019-07481-3
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-019-07481-3