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Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

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Abstract

Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

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Acknowledgements

The authors wish to thank Mr. Yu-Kai Chen for assistance with the experiments and the Taiwan ASE group for provided the experimental data in the production process.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Cheng Kung University, No. 1, University Road, Tainan, 701, Taiwan, ROC

    Kuo-Tsai Wu & Sheng-Jye Hwang

  2. Department of Engineering Science, National Cheng Kung University, No. 1, University Road, Tainan, 701, Taiwan, ROC

    Huei-Huang Lee

Authors
  1. Kuo-Tsai Wu
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  2. Sheng-Jye Hwang
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  3. Huei-Huang Lee
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Correspondence to Sheng-Jye Hwang.

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Wu, KT., Hwang, SJ. & Lee, HH. Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill. J. Electron. Mater. 46, 5094–5106 (2017). https://doi.org/10.1007/s11664-017-5516-7

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  • DOI: https://doi.org/10.1007/s11664-017-5516-7

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