Solid-state interfacial reactions between Sn and Cu(Ni) alloys have been investigated at the temperature of 125°C. The following results were obtained. Firstly, the addition of 0.1 at.% Ni to Cu decreased the total thickness of the intermetallic compound (IMC) layer to about half of that observed in the␣binary Cu/Sn diffusion couple; the Ni addition decreased especially the thickness of Cu3Sn. Secondly, the addition of 1 to 2.5 at.% Ni to Cu further decreased the thickness of Cu3Sn, increased that of Cu6Sn5 (compared to that in the binary Cu/Sn couple) and produced significant amount of voids at the Cu/Cu3Sn interface. Thirdly, the addition of 5 at.% Ni to Cu increased the total thickness of the IMC layer to about two times that observed in the binary Cu/Sn diffusion couple and made the Cu3Sn disappear. Fourthly, in contrast to the previous case, the addition of 10 at.% Ni to Cu decreased the total IMC (Cu6Sn5) thickness again close to that of the Cu/Sn couple. With this Ni content no voids were detected. The results are rationalized with the help of␣the thermodynamics of the Sn-Cu-Ni system as well as with kinetic considerations.
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Vuorinen, V., Laurila, T., Mattila, T. et al. Solid-State Reactions between Cu(Ni) Alloys and Sn. J. Electron. Mater. 36, 1355–1362 (2007). https://doi.org/10.1007/s11664-007-0251-0
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DOI: https://doi.org/10.1007/s11664-007-0251-0