Abstract
The electromigration (EM) that occurs in a Cu/Sn-9Zn/Cu lamella was investigated for hillock formation at room temperature with a current density of 103 A/cm2 for up to 230 h. Hillocks and cavities grew in the middle of the bulk solder and at the cathode, respectively. The formation of hillocks was ascribed to a compressive stress resulting from the diffusion of Sn atoms driven by electromigration and Cu-Zn compound formation.
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ACKNOWLEDGEMENTS
Support for this study from the National Science Council of the Republic of China under NSC94-2216-E-006-014 is gratefully acknowledged.
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Kuo, SM., Lin, KL. The Hillock Formation in a Cu/Sn-9Zn/Cu Lamella upon Current Stressing. J. Electron. Mater. 36, 1378–1382 (2007). https://doi.org/10.1007/s11664-007-0209-2
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DOI: https://doi.org/10.1007/s11664-007-0209-2