Abstract
Ammonia cracking efficiencies on various surfaces were examined. The following is an ordering of surfaces according to their ammonia cracking efficiencies: GaN (highest), Si3N4, SiO2 (lowest). Selective area growth of GaN was performed over SiO2 masks deposited on GaN previously grown on sapphire substrates using ammonia-based molecular beam epitaxy. GaN growth on patterned SiO2/GaN is very selective at a growth temperature of 800°C. Good quality growth occurs in the window region with no deposits on the mask surface when growth is performed at 800°C, whereas some deposits on the SiO2 masks accumulate when growth is performed at 700°C. The ratio of lateral growth rate to vertical growth rate is ≤1.
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Gupta, V.K., Averett, K.L., Koch, M.W. et al. Selective area growth of GaN using gas source molecular beam epitaxy. J. Electron. Mater. 29, 322–324 (2000). https://doi.org/10.1007/s11664-000-0071-y
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DOI: https://doi.org/10.1007/s11664-000-0071-y