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Electrochemical characterization of copper deposited on plasma and thermally modified titanium surfaces

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Abstract

Thin oxide films were grown at temperatures from 373 to 1073 K in plasma and in air on commercially pure titanium substrates. It was determined that the color, thickness, composition, phase, and polarization behavior in a copper electrolyte varied with operating conditions: temperature, oxygen partial pressure, and plasma composition. High-temperature and high oxygen partial pressure plasma produced a thick oxide film. The surface film structure transformed from TiO2 (anatase) to TiO2 (rutile) at a temperature of 600 °C. A lower oxide of the form Ti n O2n−1, such as Ti2O3 (which may be porous) or possibly Ti3O5, was formed on a thermally treated sample (400 °C, 80 mtorr O2, 3 hours). This sample exhibited the lowest potential for copper nucleation and gave a very uniform, smooth, and hole-free copper foil.

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Authors and Affiliations

  1. Integration Engineer with Winbond Electronics Corp., Taipei, Taiwan

    K. S. Teng (graduate student)

  2. Department of Metallurgie-Electrochimie, the Universite Libre de Bruxelles, B-1050, Bruxelles, Belgium

    J. -L. Delplancke (Lecturer)

  3. Caterpillar, 61656, Peoria, IL

    J. Zhang (graduate student)

  4. Department of Metallurgical Engineering and the Materials Research Center, University of Missouri-Rolla, 65409-1170, Rolla, MO

    K. S. Teng (graduate student), J. Zhang (graduate student) & T. J. O’Keefe (Professor)

Authors
  1. K. S. Teng
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  2. J. -L. Delplancke
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  3. J. Zhang
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  4. T. J. O’Keefe
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Teng, K.S., Delplancke, J.L., Zhang, J. et al. Electrochemical characterization of copper deposited on plasma and thermally modified titanium surfaces. Metall Mater Trans B 29, 749–754 (1998). https://doi.org/10.1007/s11663-998-0133-8

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  • DOI: https://doi.org/10.1007/s11663-998-0133-8

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