Abstract
High-pressure die casting (HPDC) components exhibit unique sandwich microstructural features along the thickness direction, thereby displaying solute distribution patterns distinct from those of components produced through alternative casting methods. Considering the notable influence of solute atoms on thermal conductivity, relying solely on the local microstructure to characterize the thermal conductivity of HPDC components is an incomplete approach. This work investigated the effect of thickness-dependent sandwich microstructure on the thermal conductivity of an HPDC model alloy (Mg–4Sm–2Al). The results reveal that the volume fractions of distinct layers (TSkin/T, TCore/T and TSB/T) remain constant as plate thickness increases. Nevertheless, the solute atom concentration within the skin layer gradually decreases as plate thickness increases, a phenomenon attributed to the reduced solidification rate, which allows sufficient time for solute atom precipitation. Intriguingly, within the core layer, solute atom concentration follows a nonlinear pattern, decreasing and then increasing. The varied distributions of externally solidified crystals (ESCs) are primarily responsible for this paradoxical increase. As plate thickness increases, the ESCs transform from a clustered core distribution to a uniform through-thickness distribution, progressively altering the solidification behavior of the alloy. Concurrently, an effective model for the sandwich microstructure that considers interactions among solute atoms within the α-Mg matrix is proposed. This model successfully characterizes the thermal conductivity of HPDC alloys and finds application in Mg–Sm–Al system alloys, with a relative error of less than 15 pct between the predicted and experimental results.
Similar content being viewed by others
Data Availability
The raw/processed data required to reproduce these findings cannot be shared at this time as the data also forms part of an ongoing study.
References
C. Su, D. Li, A.A. Luo, R. Shi, and X. Zeng: Metall. Mater. Trans. A, 2019, vol. 50A, pp. 1970–84.
S. Li, X. Yang, J. Hou, and W. Du: J. Magn. Alloy, 2020, vol. 8, pp. 78–90.
J. Rong, W. Xiao, X. Zhao, Y. Fu, H. Liao, C. Ma, M. Chen, and C. Huang: J. Alloy Compd., 2022, vol. 896, 162943.
C. Su, D. Li, A.A. Luo, T. Ying, and X. Zeng: J. Alloy Compd., 2018, vol. 747, pp. 431–37.
Z. Li, B. Hu, D. Li, W. Zhang, X. Zeng, Z. Lin, C. Jin, and S. Zhao: Mater. Sci. Eng. A, 2022, vol. 861, 144336.
J. Rong, W. Xiao, Y. Fu, X. Zhao, P. Yan, C. Ma, M. Chen, and C. Huang: Mater. Sci. Eng. A, 2022, vol. 849, 143500.
J.P. Weiler: J. Magn. Alloy., 2021, vol. 9, pp. 102–111.
X. Zhao, Z. Li, W. Zhou, D. Li, M. Qin, and X. Zeng: J. Mater. Res., 2021, vol. 36, pp. 3145–54.
C.M. Gourlay, H.I. Laukli, and A.K. Dahle: Metall. Mater. Trans. A, 2007, vol. 38A, pp. 1833–44.
E. Deda, T.D. Berman, and J.E. Allison: Metall. Mater. Trans. A, 2017, vol. 48A, pp. 1999–2014.
Y. Xia, J. Zheng, J. Chen, Y. Zhang, R. Shi, H. Zhou, Z. Zhou, and D. Yin: Metall. Mater. Trans. A, 2021, vol. 52A, pp. 2274–86.
C.M. Gourlay and A.K. Dahle: Nature, 2007, vol. 445, pp. 70–73.
T.D. Berman, Z. Yao, E. Deda, L. Godlewski, M. Li, and J.E. Allison: Metall. Mater. Trans. A, 2022, vol. 53A, pp. 2730–42.
J. Maxwell: A Treatise on Electricity and Magnetism, Oxford University Press, Cambridge, 1904.
J. Wang, J.K. Carson, M.F. North, and D.J. Cleland: Int. J. Heat Mass Transf., 2008, vol. 51, pp. 2389–97.
J.C. Maxwell: A Treatise on Electricity and Magnetism, 3rd ed. Dover Publications Inc., New York, 1954.
J. Wang, J.K. Carson, M.F. North, and D.J. Cleland: Int. J. Heat Mass Transf., 2006, vol. 49, pp. 3075–83.
J. He, J. Chen, H. Yan, W. Xia, B. Su, Y. Sun, Y. Nie, W. Huang, and M. Wu: J. Mater. Res., 2022, vol. 37, pp. 1727–38.
G. Luo, X. Zhou, C. Li, Z. Huang, and J. Du: Int. J. Metalcast., 2022, vol. 16, pp. 1585–94.
J.K. Chen, H.Y. Hung, C.F. Wang, and N.K. Tang: J. Mater. Sci., 2015, vol. 50, pp. 5630–39.
Q. Yang, K. Guan, X. Qiu, D. Zhang, S. Lv, F. Bu, Y. Zhang, X. Liu, and J. Meng: Mater. Sci. Eng. A, 2016, vol. 675, pp. 396–402.
X. Li, S.M. Xiong, and Z. Guo: J. Mater. Sci. Technol., 2016, vol. 32, pp. 54–61.
A.K. Dahle, S. Sannes, D.H. St. John, and H. Westengen: J. Light. Met., 2001, vol. 1, pp. 99–103.
A.K. Dahle and D.H. StJohn: Acta Mater., 1998, vol. 47, pp. 31–41.
J. Song, S.-M. Xiong, M. Li, and J. Allison: J. Alloy Compd., 2009, vol. 477, pp. 863–69.
X. Li, W. Yu, J. Wang, and S. Xiong: Mater. Sci. Eng. A, 2018, vol. 736, pp. 219–27.
C. Su, D. Li, J. Wang, R. Shi, A.A. Luo, X. Zeng, Z. Lin, and J. Chen: Mater. Sci. Eng. A, 2020, vol. 773, 138870.
Y. Bai, B. Ye, X. Yu, L. Wang, B. Zhao, and X. Kong: Metall. Mater. Trans. A, 2022, vol. 53A, pp. 4258–71.
Y. Bai, B. Ye, L. Wang, B. Zhao, X. Yu, Y. Lu, X. Kong, and W. Ding: Mater. Sci. Eng. A, 2021, vol. 802, 140655.
Meridian Lightweight Technologies, https://www.meridian-mag.com/magnesium-die-casting/lightweight-alloys/. Accessed 24 June 2023
G. Niu, J. Wang, J. Li, J. Ye, and J. Mao: Mater. Sci. Eng. A, 2022, vol. 833, 142544.
J. Zhang, J. Wang, X. Qiu, D. Zhang, Z. Tian, X. Niu, D. Tang, and J. Meng: J. Alloy Compd., 2008, vol. 464, pp. 556–64.
Z. Li, D. Li, W. Zhou, B. Hu, X. Zhao, J. Wang, M. Qin, J. Xu, and X. Zeng: J. Magn. Alloy., 2022, vol. 10, pp. 1857–67.
J.K. Chen, H.Y. Hung, C.F. Wang, and N.K. Tang: Int. J. Heat Mass Transf., 2017, vol. 105, pp. 189–95.
X. Tong, G. You, Y. Ding, H. Xue, Y. Wang, and W. Guo: Mater. Lett., 2018, vol. 229, pp. 261–64.
C. Uher: Thermal Conductivity: Theory, Properties, and Applications, Kluwer Academic/Plenum Publishers, New York, 2004.
R.W. Powell: Int. J. Heat Mass Transf., 1965, vol. 8, pp. 1033–45.
G. Kresse and J. Furthmüller: Comput. Mater. Sci., 1996, vol. 6, pp. 15–50.
X. Tao, Y. Ouyang, H. Liu, F. Zeng, Y. Feng, Y. Du, and Z. Jin: Comput. Mater. Sci., 2008, vol. 44, pp. 392–99.
G. Kresse and J. Hafner: J. Phys. Condens. Matter, 1994, vol. 6, p. 8245.
P.E. Blöchl: Phys. Rev. B, 1994, vol. 50, p. 17953.
J.P. Perdew, K. Burke, and M. Ernzerhof: Phys. Rev. Lett., 1996, vol. 77, p. 3865.
O.L. Anderson: J. Phys. Chem. Solid, 1963, vol. 24, pp. 909–17.
D.G. Cahill and R.O. Pohl: Annu. Rev. Phys. Chem., 1988, vol. 39, pp. 93–121.
H. Liu and X. Zhao: Int. J. Heat Mass Transf., 2022, vol. 183, 122089.
L. Nordheim: Ann. Phys., 1931, vol. 401, pp. 641–78.
Y. Terada, K. Ohkubo, T. Mohri, and T. Suzuki: J. Appl. Phys., 1997, vol. 81, pp. 2263–68.
X. Zheng, D.G. Cahill, P. Krasnochtchekov, R.S. Averback, and J.C. Zhao: Acta Mater., 2007, vol. 55, pp. 5177–85.
F.Q. Meng, S.H. Zhou, R.T. Ott, M.J. Kramer, and R.E. Napolitano: Materialia, 2020, vol. 9, 100595.
J.B. Vaney, A. Piarristeguy, V. Ohorodniichuck, O. Ferry, A. Pradel, E. Alleno, J. Monnier, E.B. Lopes, A.P. Gonçalves, G. Delaizir, C. Candolfi, A. Dauscher, and B. Lenoir: J. Mater. Chem. C, 2015, vol. 3, pp. 11090–98.
Acknowledgments
The National Key R&D Program (No. 2021YFB3701101) supported by the Ministry of Science and Technology of China is acknowledged. The National Natural Science Foundation of China (No. 52271009) is also acknowledged.
Author information
Authors and Affiliations
Corresponding authors
Ethics declarations
Conflict of interest
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Li, Z., Yao, F., Hu, B. et al. Effect of Thickness-Dependent Sandwich Microstructure on the Thermal Conductivity of HPDC Mg–4Sm–2Al Alloy. Metall Mater Trans A 55, 1418–1434 (2024). https://doi.org/10.1007/s11661-024-07326-7
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11661-024-07326-7