Skip to main content
SpringerLink
Log in

Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

  • Published:
Metallurgical and Materials Transactions A Aims and scope Submit manuscript

Abstract

The interfacial microstructures of Sn-3.0Ag-0.5Cu (SAC305) solder systems with thin Ni(P) mono-coatings and Cu-Ni(P) dual-coatings were investigated after reflowing and isothermal aging. The ultrathin mono-Ni(P) plating of the SAC305/Ni(P) solder joint was found to rapidly decompose and then transform into a Ni2SnP phase. An intermetallic compound (IMC) formed at the plating/substrate interface, indicating that the ultrathin mono-Ni(P) plating was not an effective diffusion barrier. However, only a single IMC layer ((Cu,Ni)6Sn5) formed at the solder/plating interface in the SAC305/Cu/Ni(P)/Cu system. The (Cu,Ni)6Sn5 IMC effectively suppressed atomic diffusion, protecting the Ni(P) plating and Cu substrate. Although P-Sn-O pores formed in the root of the (Cu,Ni)6Sn5 IMC layer, the dual-Cu/Ni(P) plating protected the solder system for an extended period. The IMC growth rate constants of the SAC305/Cu, SAC305/Ni(P), and SAC305/Cu/Ni(P)/Cu solder joint systems were 0.180, 0.342, and 0.068 μm/h1/2, respectively. These results indicate that the application of dual-Cu/Ni(P) plating can effectively hinder the growth of IMC.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18

Similar content being viewed by others

References

  1. J.W. Nah, J.H. Kim, H.M. Lee and K.W. Paik: Acta Mater., 2004, vol. 52, pp. 129-36.

    Article  CAS  Google Scholar 

  2. Y. Ding, C.Q. Wang, Y.H. Tian, and B.B. Zhang: Metall. Mater. Trans. A., 2006, vol. 37, pp.1017-25.

    Article  CAS  Google Scholar 

  3. V. Kumar, Z. Z. Fang, J. Liang and N. Dariavach: Metall. Mater. Trans. A., 2006, vol. 37, pp. 2505-14

    Article  CAS  Google Scholar 

  4. X. Gu, K.C. Yung, Y.C. Chan and D. Yang: J. Mater. Sci. - Mater. Electron., 2011, vol. 22, pp. 217-22

    CAS  Google Scholar 

  5. DG Kim, JW Kim, SB Jung (2005) Mater. Sci. Eng. B 121:204-10.

    Article  Google Scholar 

  6. S.R.A. Idris: Ph.D. Dissertation, University Teknologi Malaysia, 2008.

  7. P. Sungkhaphaitoon and T. Plookphol: Metall. Mater. Trans. A, 2018, vol. 49, pp. 652-60.

    Article  Google Scholar 

  8. A Sharif, MN Islam, YC Chan (2004) Mater. Sci. Eng. B 113:184-89.

    Article  Google Scholar 

  9. HT Lee, MH Chen, HM Jao, TL Liao (2003) Mater. Sci. Eng. A 358:134-41.

    Article  Google Scholar 

  10. L. Meinshausen: Ph.D. Dissertation, Electronics. University de Bordeaux, 2014.

  11. J. Yu and K. Kim: Metall. Mater. Trans. A, 2015, vol. 46, pp. 3173-81.

    Article  Google Scholar 

  12. S. Eraslan and M. Ürgen: Surf. Coat. Technol., 2015, vol. 265, pp. 46-52.

    Article  CAS  Google Scholar 

  13. Katarzyna N., Braszczyńska-Malik and Jacek Kamieniak: Metall. Mater. Trans. A, 2017, vol. 48, pp. 5649-57.

    Article  Google Scholar 

  14. T.R. Tamilarasan, R. Rajendran, G. Rajagopal and J. Sudagar: Surf. Coat. Technol., 2015, vol. 276, pp. 320-6.

    Article  CAS  Google Scholar 

  15. Y.C. Lin and J.G. Duh: Scripta Mater., 2006, vol. 54, pp. 1661-5.

    Article  CAS  Google Scholar 

  16. Y.C. Lin, T.Y. Shih, S.K. Tien and J.G. Duh: Scripta Mater., 2007, vol. 56, pp. 49-52.

    Article  CAS  Google Scholar 

  17. Y.C. Lin, K.J. Wang and J.G. Duh: J. Electron. Mater., 2010, vol. 39, pp. 283-94.

    Article  CAS  Google Scholar 

  18. S.P. Peng, W.H. Wu, C.E. Ho and Y.M. Huang: J. Alloys Compd., 2010, vol. 493, pp. 431-7.

    Article  CAS  Google Scholar 

  19. W.H. Wu, C.S. Lin, S.H. Huang and C.E. Ho: J. Electron. Mater., 2010, vol. 39, pp. 2387-96.

    Article  CAS  Google Scholar 

  20. C.E. Ho, C.W. Fan and W.Z. Hsieh: Surf. Coat. Technol., 2014, vol. 259, pp. 244-51.

    Article  CAS  Google Scholar 

  21. C.Y. Ho, J.G. Duh, C.W. Lin, C.J. Lin and Y.H. Wu: J. Mater. Sci., 2013, vol. 48, pp. 2724-32.

    Article  CAS  Google Scholar 

  22. C.Y. Liu and S.J. Wang: J. Electron. Mater., 2003, vol. 32, pp. 1303-9.

    Article  Google Scholar 

  23. S.J. Wang and C.Y. Liu: Scripta Mater., 2003, vol. 49, pp. 813-8.

    Article  CAS  Google Scholar 

  24. B Lee, H Jeon, KW Kwon, HJ Lee (2013) Acta Mater. 61: 6736-42.

    Article  CAS  Google Scholar 

  25. J. Liang, N. Dariavach, P. Callahan and D. Shangguan: Mater. Trans., 2006, vol. 47, pp. 317-25.

    Article  CAS  Google Scholar 

  26. P. Chen, X. Zhao, Y. Wang, Y. Liu, H. Li and Y. Gu: J. Mater. Sci. - Mater. Electron., 2015, vol. 26, pp. 1940-9.

    CAS  Google Scholar 

  27. X. Hu, T. Xu, L.M. Keer, Y. Li and X. Jiang: J. Alloys Compd., 2017, vol. 690, pp. 720-9.

    Article  CAS  Google Scholar 

  28. M. Haerifar and M. Zandrahimi: Appl. Surf. Sci., 2013, vol. 284, pp. 126-32.

    Article  CAS  Google Scholar 

  29. CW Liu, YL Wang, MS Tsai, HP Feng, SC Chang (2005) J. Vac. Sci. Technol. A 23:658-62.

    Article  CAS  Google Scholar 

  30. Quéré D: Annu. Rev. Mater. Res., 2008, vol. 38, pp. 71-99.

    Article  Google Scholar 

  31. W. Liu and D.P. Sekulic: Langmuir, 2011, vol. 27, pp. 6720-30.

    Article  CAS  Google Scholar 

  32. J.W. Yoon and S.B. Jung: J. Mater. Sci., 2004, vol. 39, pp. 4211-7.

    Article  CAS  Google Scholar 

  33. P.T. Vianco, J.A. Rejent and P.F. Hlava: J. Electron. Mater., 2004, vol. 33, pp. 991-1004.

    Article  CAS  Google Scholar 

  34. J.Y. Park, C.W. Yang, J.S. Ha, C.U. Kim, E.J. Kwon, S.B. Jung and C.S. Kang: J. Electron. Mater., 2001, vol. 30, pp. 1165-70.

    Article  CAS  Google Scholar 

  35. C.Y. Ho, J.G. Duh, C.W. Lin, C.J. Lin, Y.H. Wu, H.C. Hong and T.H. Wang: J. Mater.Sci., 2013, vol. 48, pp. 2724-32.

    Article  CAS  Google Scholar 

  36. Y.C Lin, K.J. Wang and J.G. Duh: J .Electron. Mater., 2010, vol. 39, pp. 283-94.

    Article  CAS  Google Scholar 

  37. C.Y. Ho, J.G. Duh: Mater. Chem. Phys., 2014, vol. 148, pp. 21-7.

    Article  CAS  Google Scholar 

  38. V. Vuorinen, T. Laurila, H. Yu and J.K. Kivilahti: J. Appl. Phys., 2006, vol. 99, pp. 3530-36.

    Article  Google Scholar 

  39. Z. Chen, A. Kumar and M. Mona: J. Electron. Mater., 2006, vol. 35, pp. 2126-34.

    Article  CAS  Google Scholar 

  40. C.E. Ho, C.W. Fan, W.H. Wu and T.T. Kuo: Thin Solid Films, 2013, vol. 529, pp. 364-8.

    Article  CAS  Google Scholar 

  41. W.M. Chen, S.C. Yang, M.H. Tsai and C.R. Kao: Scripta Mater., 2010, vol. 63, pp. 47-9.

    Article  Google Scholar 

  42. K.N. Tu and K. Zeng: Mater. Sci. Eng. R, 2001, vol. 34, pp. 1-58..

    Article  Google Scholar 

  43. W. Peng, E. Monlevade and M.E. Marques: Microelectron. Reliab., 2007, vol. 47, pp. 2161-8.

    Article  CAS  Google Scholar 

  44. J. Shen, M. Zhao, P. He and Y. Pu: J. Alloys Compd., 2013, vol. 574, pp. 451-8.

    Article  CAS  Google Scholar 

  45. D.G. Kim and S.B. Jung: J. Alloys Compd., 2005, vol. 386, pp. 151-6.

    Article  CAS  Google Scholar 

Download references

Acknowledgments

This study was supported by the Nature Science Foundation of China (No. 51465039, 51765040), and the Nature Science Foundation of Jiangxi Province (20161BAB206122).

Author information

Authors and Affiliations

  1. Key Lab for Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang, 330031, China

    Zhe Zhang, Xiaowu Hu, Xiongxin Jiang & Yulong Li

Authors
  1. Zhe Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaowu Hu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Xiongxin Jiang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yulong Li
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Xiaowu Hu or Yulong Li.

Additional information

Manuscript submitted January 15, 2018.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Zhang, Z., Hu, X., Jiang, X. et al. Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints. Metall Mater Trans A 50, 480–492 (2019). https://doi.org/10.1007/s11661-018-4983-7

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11661-018-4983-7

Search

Navigation