Abstract
Electrodeposition of nickel was studied by the AC (as a novel technique) and DC techniques in nickel chloride aqueous solutions, mixed with various amounts of cysteine (0 to 6 mM). Cyclic voltammetry and chronoamperometry data have shown that the electrodeposition of Ni in the presence of cysteine is not diffusion controlled, but is closer to instantaneous nucleation. However, the current distribution decreased with the addition of further cysteine. The nucleation sites were decreased from 1.72 × 106 to 0.190 × 106 (cm−2) when the concentration of cysteine was increased from 0 to 4 mM. AC impedance during electrodeposition shows that the charge transfer resistance is increased from 0.645 to 5.26 Ω cm2 when the concentration of cysteine is increased from 0.5 to 4 mM. The electro-corrosion tests were done to investigate the corrosion behavior of the electrodeposited layers. X-ray diffraction and scanning electron microscopy containing Energy dispersive X-ray were used to estimate the grain size of the electrodeposited layers and capture the micrograph images and roughness of the Ni-electrodeposited surface.
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We thank the University of Malaya for financial support from the University research grant UMRG091/10AFR and FRGS grant number RG181 12SUS.
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Manuscript submitted July 10, 2011.
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Ebadi, M., Basirun, W.J., Sim, YL. et al. Investigation of Electro-Kinetic Behavior of Cysteine on Electrodeposition of Ni Through the AC and DC Techniques. Metall Mater Trans A 44, 5096–5105 (2013). https://doi.org/10.1007/s11661-013-1881-x
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DOI: https://doi.org/10.1007/s11661-013-1881-x