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On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding

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Abstract

Transient-liquid phase (TLP) bonding of a nickel-based superalloy, IN 738, was performed. Contrary to conventional TLP bonding analytical models, which assume a parabolic relationship between liquid/solid interface migration and holding time, deviation from this law was observed experimentally and by numerical simulation. The deviation, which is caused by reduction in solute concentration gradient below a critical value, is suggested as an alternate phenomenon responsible for anomalous extension of processing time required to produce an eutectic-free joint with increase in bonding temperature. A decrease in the filler gap size and the use of a melting-point depressant (MPD) solute with higher solubility in the base material could reduce the occurrence of the anomalous behavior during a high-temperature TLP joining process.

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Notes

  1. IN is a trademark of INCO Alloys International, Huntington, WV.

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Acknowledgment

The authors gratefully acknowledge the financial support by the URGP of the University of Manitoba.

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Correspondence to O.A. Ojo.

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Manuscript submitted July 12, 2008.

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Abdelfatah, M., Ojo, O. On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding. Metall Mater Trans A 40, 377–385 (2009). https://doi.org/10.1007/s11661-008-9726-8

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