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Recalescence Velocity and Microstructure Evolution of Deeplyundercooled Cu65Ni35 Alloy

  • Metallic Materials
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Abstract

The Cu65Ni35 alloy liquid was undercooled by the fluxing method, and the rapid solidification structure was obtained by natural cooling. The solidification interface migration information of Cu65Ni35 alloy liquid in rapid solidification stage was photographed with the help of high-speed camera, and the recalescence velocity was calculated. The microstructure evolution of the alloy was systematically studied by observing the microstructure morphology and taking photos on the metallographic microscope. By analyzing the evolution of dendrite grain size and microstructure microhardness with undercoolingand relying on electron backscatter diffraction (EBSD) technology, the grain refinement mechanism of microstructure under high undercooling and low undercooling is finally confirmed.

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Funding

Funded by the National Natural Science Foundation of China (No.51701187), and the Basic Applied Research Projects in Shanxi Province (201801D221151)

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Authors and Affiliations

  1. College of Mechanical Engineering, North University of China, Taiyuan, 030051, China

    Hailong Liang  (梁海龙), Tang Cheng, Ruiqin Li  (李瑞琴) & Hongfu Wang

  2. College of Materials Science and Engineering, North University of China, Taiyuan, 030051, China

    Yuhong Zhao  (赵宇宏)

  3. Shanxi College of Technology, Shuozhou, 036000, China

    Hailong Liang  (梁海龙)

  4. Jiangsu Yingchuang Power Technology Co. Ltd, Suzhou, 215000, China

    Jine Yang & Jinpeng Xie

Authors
  1. Hailong Liang  (梁海龙)
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  2. Tang Cheng
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  3. Ruiqin Li  (李瑞琴)
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  4. Hongfu Wang
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  5. Jine Yang
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  6. Jinpeng Xie
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  7. Yuhong Zhao  (赵宇宏)
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Corresponding authors

Correspondence to Ruiqin Li  (李瑞琴) or Yuhong Zhao  (赵宇宏).

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Liang, H., Cheng, T., Li, R. et al. Recalescence Velocity and Microstructure Evolution of Deeplyundercooled Cu65Ni35 Alloy. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 37, 277–284 (2022). https://doi.org/10.1007/s11595-022-2528-9

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  • DOI: https://doi.org/10.1007/s11595-022-2528-9

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