Abstract
Dynamic mechanical thermal analysis was used to investigate the thermal transitions and modulus/temperature behavior of thermoformable carrier films, and to relate the information obtained to carrier film behavior during the thermoforming process. In this study the glass transition temperatures (T g) and the temperatures at which crystallization occurred during heating (T c) of four thermoformable carrier films were measured by using a dynamic mechanical thermal analyzer (DMTA). These films are good candidates for the automotive process, which uses painted carrier films as moldable automotive coatings (MAC). The modulus/temperature behavior of the films was also observed over a wide temperature range, which included thermoforming temperatures. Although films of PETG and PCTG 5445, co-polyesters based on poly(1,4-cyclohexylene dimethylene terephthalate), are thermoformable, their T g values, 92 and 99 °C, respectively, are not high enough to allow current paint systems (with bake temperature of 100–110 °C) to cure on the films without causing severe film deformation.
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Jodeh, S. Carrier films behavior during thermoforming process studied using dynamic mechanical thermal analysis (DMTA). J Polym Res 18, 939–944 (2011). https://doi.org/10.1007/s10965-010-9491-4
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DOI: https://doi.org/10.1007/s10965-010-9491-4