Abstract
Present investigation deals with appraising heat transfer enhancement of single phase microchannel heat sink (MCHS) by ultra fine Cu particle incorporation in base coolant fluid. The particle diameter is of nanometer size and base fluid in combination of nanoparticles is called nanofluid. Governing equations for fluid flow and heat transfer are based on well established “porous medium model” and accordingly, modified Darcy equation and two-equation model are employed. Appropriate equations for both fluid flow and heat transfer are derived and cast into dimensionless form. Velocity profile is obtained analytically and in order to solve conjugate heat transfer problem a combined analytical–numerical approach is employed. For heat transfer analysis, thermal dispersion model is adopted and latest proposed model for effective thermal conductivity – which considers the salient effect of interfacial shells between particles and base fluid – is integrated into model. The effects of dispersed particles concentration, thermal dispersion coefficient and Reynolds number are investigated on thermal fields and on thermal performance of MCHS. Additionally, the impact of turbulent heat transfer on heat transfer enhancement is considered.
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Abbreviations
- A P :
-
wetted area per volume
- \(\tilde{C}\) :
-
thermal conductivity ratio
- C * :
-
thermal dispersion coefficient
- C f :
-
fluid heat capacity
- D :
-
group parameter, hA P H 2/(1 − ɛ)k s
- Da:
-
Darcy number, K/H 2
- D h :
-
channel hydraulic diameter
- d P :
-
nanoparticle diameter
- h :
-
interfacial heat transfer coefficient
- \(\bar{h}\) :
-
average interfacial heat transfer coefficient
- H :
-
channel height
- K :
-
permeability
- k d :
-
dispersed thermal conductivity of nanofluid
- k f :
-
fluid thermal conductivity
- k fe :
-
effective thermal conductivity of fluid, ɛ k f
- k s :
-
solid thermal conductivity
- k se :
-
effective thermal conductivity of solid, (1 − ɛ)k s
- L :
-
channel height
- Nu∞ :
-
interfacial Nusselt number
- \(\overline{\rm Nu}\) :
-
overall Nusselt number
- p :
-
pressure
- \(\bar{p}\) :
-
volume averaged pressure
- P :
-
dimensionless pressure
- Pe :
-
Peclet number
- Pr :
-
Prandtl number
- q W :
-
heat flux over bottom surface
- T :
-
Temperature
- u :
-
fluid velocity
- \(\bar{u}\) :
-
volume averaged velocity
- U :
-
dimensionless fluid velocity
- w c :
-
channel width
- w f :
-
wall thickness
- X :
-
dimensionless axial coordinate
- Y :
-
dimensionless vertical coordinate
- Greek symbols: :
-
- α:
-
thermal diffusivity
- η:
-
channel aspect ratio, H/w C
- ɛ:
-
porosity
- μ:
-
viscosity
- ρ:
-
density
- θ:
-
dimensionless temperature, y-dependent part
- ϕ:
-
nanoparticle concentration
- Subscripts: :
-
- b:
-
bulk
- f:
-
fluid
- nf:
-
nanofluid
- m:
-
mean value
- s:
-
solid
- sh:
-
solid-like interfacial shell
- w:
-
wall
References
D. B. Tuckerman and R. F. W. Pease, IEEE Electron. Dev. Lett. EDL-2, 126–129 (1981)
D. B. Tuckerman and R. F. W. Pease, in IEEE Proc. 32nd Electronics Conference, 145–149 (1982)
M. Mahalingam, in Proceedings of IEEE 73, 1396–1404 (1985)
T. Kishimoto and T. Ohsaki, in 25th Electrics Components Conference Proceedings, 595–601 (1986)
R. J. Philips, in A. Bar-Cohen and A. D. Kraus (eds), Advances in Thermal Modelling of Electronic Components and Systems, vol 2. ASME, New York, (Chapter 3) (1990)
Koh J. C. Y., Colony R. (1986). Int. Comm. Heat Mass Transfer 13:89–98
Kim S. J., Kim D., Lee D. Y. (2000). Int. J. Heat Mass Transfer 43:1735–1748
Zhao C. Y, Lu T. J. (2002). Int. J. Heat Mass Transfer 45:4857-4869
Kim S. (2004). Heat Transfer Eng. 25:37–49
Vafai K., Zhu L. (1999). Int. J. Heat Mass Transfer 42:2287–2297
Vafai K., Huang P. C. (1994). ASME J. Heat Transfer 116:604–613
Huang P. C., Vafai K. (1994). AIAA J Thermophys Heat Transfer 8:563–573
Hadim A. (1994). ASME J Heat Transfer 116:465–472
Bowers M. B., Mudawar I. (1994). ASME J Electr Packaging 116:290–305
Choi S. U. S. (1995). ASME FED 231:99–103
J.A. Eastman, S. U. S. Choi, S. Li, L. J. Thompson, and S. Lee, in 1996 Fall Meeting of the Materials Research Society (MRS), Boston, USA (1996)
Lee S., Choi S. U. S., Li S., Eastman J. A. (1999). ASME J Heat Transfer 121:280–289
Xuan Y. M., Li Q. (2000). Int. J. Heat Fluid Flow 21:58–64
Eastman J. A., Choi S. U. S., Li S., Yu W., Thompson L. J. (2001). Appl. Phys. Lett. 78:718–720
Keblinski P., Phillpot S. R. E., Choi S. U. S., Eastman J. A. (2002) Int. J. Heat Mass Transfer 45:855–863
Xie H., Wang J., Xi T. G., Liu Y., Ai F. (2002). J. Appl. Phys. 91:4568–4572
Wang X. W., Xu X. F., Choi S. U. S. (1999). J. Thermophys. Heat Transfer 13:474–480
Wen D. S., Ding Y. L. (2004). Int. J. Heat Mass Transfer 47:5181–5188
Wang B. X., Zhou L. P., Peng X. F. (2003). Int J Heat Mass Transfer 46:2665–72
Xue Q., Xu W. M. (2005). Mater. Chem. Phys. 90:298–301
S. Lee and S. U. S. Choi, in 1996 International Mechanical Engineering Congress and Exhibition, Atlanta, USA (1996)
Pak B. C., Cho Y. I. (1999). Heat Transfer 11:151–170
Xuan Y. M., Roetzel W. (2000). Int. J. Heat Mass Transfer 43:3701–3707
Li Q., Xuan Y. M. (2002). Sci. China, Series E 45:408–416
Xuan Y. M., Li Q. (2003). ASME J. Heat Transfer 125:151–155
Khanafer K., Vafai K., Lightstone M. (2003). Int. J. Heat Mass Transfer 46:3639–3653
Chein R., Huang G. (2005). Appl. Therm. Eng. 25:3104–3114
Koo J., Kleinstreuer C. (2005). Int. J. Heat Mass Transfer 48:2652–2661
Vafai K., Tien C. L. (1981). Int. J. Heat Mass Transfer 24:195–203
Hunt M. L., Tien C. L. (1988). Int. J. Heat Mass Transfer 31:301–309
Plumb O. A. (1983). ASME JSME Therm. Eng. Joint Conf. 2:17–22
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Abbassi, H., Aghanajafi, C. Evaluation of Heat Transfer Augmentation in a Nanofluid-Cooled Microchannel Heat Sink. J Fusion Energ 25, 187–196 (2006). https://doi.org/10.1007/s10894-006-9021-x
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DOI: https://doi.org/10.1007/s10894-006-9021-x