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The reliability assessment of Au–Al bonds using parallel gap resistance microwelding

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Abstract

The Au–Al bonding joint was prepared by the parallel gap resistance microwelding. The microstructural evolution of Au–Al bonds was investigated under thermal aging, and the mechanical properties of Au–Al intermetallic compounds (IMCs) were computed by the first-principles calculations. We found that the Au–Al IMCs along with cracks grew during aging time and temperature increasing. The formation of the cracks is explained by the Kirkendall effect, volumetric shrinkages and thermal mismatch. Based on the experimental data, the growth of the IMCs is fitted to the diffusion equation to describe the performance degradation of Au–Al bonds. The Arrhenius relationship is introduced as the acceleration model to describe the effects of thermal stress on lifetime. Furthermore, the Weibull–Arrhenius model is built by the combination of the Weibull distribution and the Arrhenius relationship, which provide a method to estimate the lifetime distribution under work condition.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (51572190).

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Authors and Affiliations

  1. Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Department of Applied Physics, Faculty of Science, Tianjin University, Tianjin, 300354, People’s Republic of China

    Peng Liu, Xiang Lin & Ping Wu

  2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang, 621900, People’s Republic of China

    Sen Cong & Xingwen Tan

Authors
  1. Peng Liu
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  2. Sen Cong
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  3. Xingwen Tan
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  4. Xiang Lin
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  5. Ping Wu
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Correspondence to Sen Cong or Ping Wu.

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Liu, P., Cong, S., Tan, X. et al. The reliability assessment of Au–Al bonds using parallel gap resistance microwelding. J Mater Sci: Mater Electron 31, 6313–6320 (2020). https://doi.org/10.1007/s10854-020-03187-z

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  • DOI: https://doi.org/10.1007/s10854-020-03187-z

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