Abstract
Spontaneous growth of Sn whiskers has seriously affected the reliability of electronic systems and caused many major accidents. Its growth mechanism and mitigation strategy have been the focus of research in the past decades. In this paper, a large number of Sn whiskers were found to grow quickly on Al–Sn alloys prepared by mechanical alloying when treated at 300 °C. Different from the large randomness of the whisker growth on metallic coatings and platings as in major research work of this topic, the Sn whisker growth from ball-milled Al–Sn substrate shows good repeatability. To demonstrate the compressive stress in the samples, X-ray diffraction residual stress analysis was detected. An average compressive stresses in Al phase after heat treatment was 81.2 MPa, which may have been responsible for the whiskers growing directly on the surface. Meanwhile, the interfacial energy caused by high-energy ball milling may have played a positive role in the growth of whiskers. Sn whiskers formed on Al–Sn alloy samples have shorter incubation period and faster growth rate, which makes it much more convenient to research the mechanism.
Similar content being viewed by others
References
T. Shibutani, Q. Yu, M. Shiratori, M.G. Pecht, Microelectron. Reliab. 48, 1033 (2008)
P. Xue, S.B. Xue, Y.F. Shen, F. Long, H. Zhu, J. Mater. Sci. 25, 3520 (2014)
A. He, D.G. Ivey, J. Mater. Sci. 50, 2944 (2015)
B. Lee, D.N. Lee, Acta Mater. 46, 3701 (1998)
S.E. Koonce, S.M. Arnold, J. Appl. Phys. 24, 365 (1953)
A. Baated, K.S. Kim, K. Suganuma, J. Mater. Res. 25, 2175 (2011)
N.P. Shetti, S.D. Bukkitgar, K.R. Reddy, C.V. Reddy, T.M. Aminabhavi, Biosens. Bioelectron. 141, 111417 (2019)
C.M. Huang, D. Nunez, J. Coburn, M. Pecht, Microelectron. Reliab. 81, 22 (2018)
M.L. Sun, X.P. Long, M.Y. Dong, Y.Y. Xia, F.T. Hu, A.M. Hu, M. Li, Mater. Charact. 134, 354 (2017)
H. Cobb, Mon. Rev. Am. Electroplat. Soc. 33, 28 (1946)
K. Compton, A. Mendizza, S. Arnold, Corrosion 7, 327 (1951)
R.F. Champaign, R.R. Ogden, J. Fail. Anal. Prev. 10, 444 (2010)
N. Furuta, K. Hamamura, Jpn. J. Appl. Phys. 8, 1404 (1969)
V.V. Simakov, I.V. Sinev, A.V. Smirnov, A.I. Grebennikov, Tech. Phys. 61, 574 (2016)
C.F. Li, Z.Q. Liu, J.K. Shang, J. Alloys Compd. 550, 231 (2013)
L. Panashchenko, J. Brusse, H. Leidecker, IPC Tin Whisker conference, European Commission (2010)
J.D. Eshelby, Phys. Rev. 91, 755 (1953)
K.N. Tu, Phys. Rev. B 49, 2030 (1994)
Y. Wang, J.E. Blendell, C.A. Handwerker, J. Mater. Sci. 49, 1099 (2013)
W. Ellis, Growth and perfection of crystals international conference on crystal growth, Cooperstown, New York, 102 (1958)
M.Z. Liu, J. Tao, C.Y. Nam, K. Kisslinger, L.H. Zhang, D. Su, Nano Lett. 14, 5630 (2014)
Y.S. Liu, P.G. Zhang, C. Ling, J.X. Ding, W.B. Tian, Y.M. Zhang, Z.M. Sun, J. Mater. Sci. 28, 5788 (2017)
A. Kosinova, D. Wang, P. Schaaf, A. Sharma, L. Klinger, E. Rabkin, Acta Mater. 149, 154 (2018)
W. Zhou, H.B. Zhang, P. Wu, Vacuum 107, 103 (2014)
I. Balazs, H. Barbara, H. Gabor, Surf. Coat. Tech. 205, 2262 (2010)
F.C. Walsh, C.T.J. Low, Surf. Coat. Tech. 288, 79 (2016)
U. Lindborg, Acta Metal. 24, 181 (1976)
H. Hunsicker, L. Kenspf, Quart. Trans. SAE 1, 6 (1947)
R.Z. Hu, X. Liu, M.Q. Zeng, J. Chin. Electron Microsc. Soc. 30, 494 (2011)
A.A. El-Daly, A.A. Ibrahiem, J. Alloys Compd. 730, 47 (2018)
P. Jagtap, V.A. Sethuraman, P. Kumar, J. Electron. Mater. 47, 5229 (2018)
C.V. Reddy, I.N. Reddy, K.R. Reddy, S. Jaesool, K. Yoo, Electrochim. Acta 317, 416 (2019)
N.P. Shetti, S.J. Malode, D.S. Nayak, G.B. Bagihalli, S.S. Kalanur, R.S. Malladi, C.V. Reddy, T.M. Aminabhavi, K.R. Reddy, Appl. Surf. Sci. 496, 143656 (2019)
D.R. Overcash, E.P. Stillwell, M.J. Skove, J.H. Davis, Philos. Mag. 25, 1481 (1972)
S.H. Liu, L.M. Ma, Y.T. Shu, Y. Zuo, F. Guo, Rare Met. Mater. Eng. 44, 2868 (2015)
J. Wu, S.B. Xue, J.W. Wang, J.X. Wang, Microelectron. Reliab. 79, 124 (2017)
K.N. Tu, J.C.M. Li, Mater. Sci. Eng. A 409, 131 (2005)
M.W. Barsoum, E.N. Hoffman, R.D. Doherty, S. Gupta, A. Zavaliangos, Phys. Rev. Lett. 93, 206104-1 (2004)
Acknowledgements
The research is supported by the Grant of National Natural Science Foundation of China (No. 51731004).
Author information
Authors and Affiliations
Corresponding authors
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Zhang, Y., Zhang, P., He, W. et al. Tin whisker growth on immiscible Al–Sn alloy. J Mater Sci: Mater Electron 31, 1328–1334 (2020). https://doi.org/10.1007/s10854-019-02646-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-019-02646-6