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Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

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Abstract

Flip-chip light-emitting diode (FCLED) packages were interconnected with various contents of Sn-decorated multi-walled carbon nanotube (Sn–MWCNT) composite solder. The Sn–MWCNT was synthesized with a Sn solution using polyol to decorate Sn nanoparticle on the surface of MWCNTs. The Sn-58Bi solder pastes containing Sn–MWCNTs were printed on the metal-printed circuit boards, and then bonded with a flip-chip bonder. The mechanical property of FCLED packages with various contents of Sn–MWCNTs were evaluated with a bond tester. Thermal property was measured with IR Camera and laser flash analysis. The shear strength of an LED chip with 0.1 wt% Sn–MWCNT solder increased about 25% over that without Sn–MWCNT. The LED chip temperature with 0.1 wt% Sn–MWCNT nanocomposite solder decreased about 7% compared to that of the Sn-58Bi solder.

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Acknowledgments

This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2017R1D1A1B03035587). This research was financially supported by the Ministry of Trade, Industry, and Energy (MOTIE), Korea, under the “Regional Specialized Industry Development Program” (reference number P0002867) supervised by the Korea Institute for Advancement of Technology (KIAT).

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Authors and Affiliations

  1. School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-Gu Suwon, 16419, Republic of Korea

    Choong-Jae Lee, Haksan Jeong, Kwang-Ho Jung, Kyung Deuk Min & Seung-Boo Jung

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  1. Choong-Jae Lee
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  2. Haksan Jeong
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  3. Kwang-Ho Jung
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Correspondence to Seung-Boo Jung.

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Lee, CJ., Jeong, H., Jung, KH. et al. Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder. J Mater Sci: Mater Electron 30, 12869–12875 (2019). https://doi.org/10.1007/s10854-019-01648-8

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  • DOI: https://doi.org/10.1007/s10854-019-01648-8

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