Skip to main content
SpringerLink
Log in

The electrical properties enhance of BEP laminate employing HBP blocking by hexanoic acid

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

A laminate aimed to be used in high frequency CCL is prepared by introducing free volume into employing adding HBP blocking by hexanoic acid (HBP-C6). The effects of HBP-C6 on the electrical properties is analyzed. The results indicated the permittivity (Dk) of laminated is 4.03 and the dielectric loss (Df) is 0.00018 at the frequency of 107 Hz, when the HBP-C6 content is 15 wt%. The breakdown strength of the laminate is 28.62 kV/mm, the volume resistivity of composites is 3.25 × 1014 Ω m, which shows a good insulation property. The mechanical, moisture absorption rate, peel strength and flame retardant results also give the application possibility on high frequency CCL.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12

Similar content being viewed by others

References

  1. C. Wang, N. Wen, G. Zhou, Appl. Surf. Sci. 422, 738–744 (2017)

    Article  Google Scholar 

  2. L.P. Laforte, L.L. Lebel, Polym. Test. 67, 205–212 (2018)

    Article  Google Scholar 

  3. H. Futian, Z.R. Yang, Acta Mater. Compos. Sin. 2, 38–41 (2008)

    Google Scholar 

  4. H Qi-bin, Z. Le, D. Renjie, Insul. Mater. 50, 30–34 (2017)

    Google Scholar 

  5. D. Zhuo, A. Gu, G. Liang, J. Mater. Sci. 46, 1571–1580 (2011)

    Article  Google Scholar 

  6. G. Rui, A. Gu, G.J. Liang, Appl. Polym. Sci. 121, 16759–1684 (2011)

    Google Scholar 

  7. M. Zhang, H. Yan, C. Liu, Polym. Compos. 36, 1840–1848 (2015)

    Article  Google Scholar 

  8. J.O. Simpson, A.K.S. Clair, Thin Solid Films 308–309, 480–485 (1997)

    Article  Google Scholar 

  9. C. Feng, M. Liang, J. Jiang, Thermochim. Acta 627–629, 83–90 (2016)

    Article  Google Scholar 

  10. Z. Zheng, Y. Liu, L. Zhang, J. Mater. Sci. 51, 5857–5871 (2016)

    Article  Google Scholar 

  11. W.M. Arden, Solid State Mater. Sci. 6, 371–377 (2002)

    Article  Google Scholar 

  12. C.J. Hawker, R. Lee, J.M. Frechet, J. Am. Chem. Soc. 12, 4583–4588 (1991)

    Article  Google Scholar 

  13. J.Y. Lv, Y. Meng, L.F. He, Appl. Mech. Mater. 262, 448–453 (2013)

    Article  Google Scholar 

  14. H. Treichel, G. Ruhl, P. Ansmann, Microelectron. Eng. 40, 1–19 (1998)

    Article  Google Scholar 

  15. G. Lee, B.K. Lai, C.J. Phatak, Appl. Phys. 114, 1321–5712 (2013)

    Google Scholar 

  16. A.K. Yadav, P.A. Jha, S. Murugavel, Solid State Ion. 296, 54–62 (2016)

    Article  Google Scholar 

  17. S.W. Martin, Appl. Phys. 49, 239 (1989)

    Article  Google Scholar 

  18. B. Roling, A. Happe, K. Funke, M.D. Ingram, Phys. Rev. 78, 2160 (1997)

    Google Scholar 

  19. J.Y. Li, P. Chen, Z.M. Ma, Mater. Sci. Eng. 25, 141–143 (2009)

    Google Scholar 

  20. Y. Reiming, W.L. Gong, Y. Huarong, J. Cent. South Univ. 44, 526–531 (2013)

    Google Scholar 

  21. J.K. Nelson, Nanotechnology 15, 586–595(2004)

    Article  Google Scholar 

  22. Y. Celikbag, S. Meadows, M. Barde, Ind. Eng. Chem. Res. 56, 9389–9400 (2017)

    Article  Google Scholar 

  23. E.A. Stroganova, V.F. Anufrienko, T.V. Larina, Russ. J. Phys. Chem. A 91, 1548–1556 (2017)

    Article  Google Scholar 

  24. S.M. Hubig, A. Rajendra Rathore, J.K. Kochi, J. Am. Chem. Soc. 121, 617–626 (1999)

    Article  Google Scholar 

  25. B.A. Rozenberg, Macromol. Symp. 10, 113–165 (1986)

    Google Scholar 

  26. D.E. Lee, H.W. Kim, B. Kong, J. Appl. Polym. Sci. 134, 45252 (2017)

    Article  Google Scholar 

  27. X. Zhang, Y. Zhang, Liao, J. Appl. Polym. Sci. 132, 32 (2015)

    Google Scholar 

  28. R.J. Messinger, T.G. Marks, S.S. Gleiman, Macromolecules 48, 4835–4849 (2015)

    Article  Google Scholar 

  29. Y.H. Yang, H.J. Sun, T.J. Peng, Acta Phys.-Chim. Sin. 27, 736–742 (2011)

    Google Scholar 

  30. C. Feng, Z. Yi, Z. Chi, Polym. Degrad. Stab. 97, 707–714 (2012)

    Article  Google Scholar 

  31. M. Zanetti, G. Camino, D. Canavese, Chem. Mater. 14, 189–193 (2002)

    Article  Google Scholar 

Download references

Author information

Author notes

  1. Zilong Wang and Xiaorui Zhang have contributed equally to this work.

Authors and Affiliations

  1. Department of Polymer Materials, School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, People’s Republic of China

    Zilong Wang, Xiaorui Zhang & Ling Weng

  2. Department of Metal Materials, School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, People’s Republic of China

    Lizhu Liu

  3. Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin, 150080, People’s Republic of China

    Lizhu Liu

Authors
  1. Zilong Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaorui Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Ling Weng
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Lizhu Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Lizhu Liu.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Wang, Z., Zhang, X., Weng, L. et al. The electrical properties enhance of BEP laminate employing HBP blocking by hexanoic acid. J Mater Sci: Mater Electron 29, 15147–15155 (2018). https://doi.org/10.1007/s10854-018-9656-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-018-9656-1

Search

Navigation