Skip to main content

Advertisement

SpringerLink
Log in

Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Fluxless bonding of plateless Cu–Cu substrates at processing temperature lower than 250 °C and low pressure of 0.1 MPa was achieved by transient liquid phase sintering (TLPS) of mixed Cu nanoparticles and Sn–Bi eutectic powders. The effects of mixture composition, and sintering temperature on the shear strength, microstructure, and remelting temperature were investigated. Lowering the sintering temperature of Cu mixed with 65 weight percentage of Sn–Bi (Cu–65SnBi) resulted in decreased shear strength, however, at 200 °C sintering temperature, the obtained highest shear strength was more than 20 MPa. It was found that it is essential to use Cu nanoparticles to accelerate the consumption so that no initial Sn–Bi phases remained after processing. The liquid phase generated at approximately 196 °C during sintering from the reaction between newly formed Cu6Sn5 and Bi-phase was expected to facilitate the densification and strengthening of the joints. Although this newly generated liquid phase was known to solidify as hypereutectic Sn–Bi, by controlling the sintering temperature at 200 °C, the remelting event at 139 °C was not observed by differential scanning calorimetry. It is assumed that the proportion of solidified Sn–Bi eutectic phases in Cu–65SnBi that was sintered at 200 °C were significantly small, hence, when reheated at 150 °C, the obtained shear strength was equivalent to that at room temperature.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. Y. Ikeda, Y. Iizuka, Y. Hinata, M. Horio, M. Hori, Y. Takahashi, Investigation on wirebond-less power module structure with high-density packaging and high reliability, IEEE 23rd International Symposium on Power Semiconductor Devices and ICs, San Diego, CA, pp. 272–275 (2011)

  2. Y. Hinata, M. Horio, Y. Ikeda, R. Yamada, Y. Takahashi, Full SiC power module with advanced structure and its solar inverter application, 28th Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Long Beach, CA, pp. 604–607 (2013)

  3. J. W. Yoon, B. I. Noh, S. B. Jung, Mechanical reliability of Sn-Ag BGA solder joints with various electroless Ni-P and Ni-B plating layers, IEEE Trans. Compon. Packag. Manuf. Technol. 33, 222 (2010)

    Article  Google Scholar 

  4. H. Nishikawa, J. Y. Piao, T. Takemoto, Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate. J Electron. Mater. 35, 1127 (2006)

    Article  Google Scholar 

  5. H. Beyer, V. Sivasubramaniam, D. Hajas, E. Nanser, F. Brem, Reliability Improvement of Large Area Soldering Connections by Antimony Containing Lead-Free Solder, PCIM Europe Nuremberg, Germany, pp. 1–8 (2014)

  6. T. Kuniaki, T. Shinichi, T. Yoshikazu, D. Takuya, Introduction to reliability of energy devices (The Nikkan Kogyo Shimbun, Ltd., Nagoya, 2012), pp. 154–156 (in Japanese)

    Google Scholar 

  7. EIAJ ED-4701/100, http://home.jeita.or.jp/tsc/std-pdf/ED-4701_100.pdf. Accessed 15 May 2017

  8. O. Mokhtari, H. Nishikawa, Transient liquid phase bonding of Sn-Bi solder with added Cu particles. J. Mater Sci. 27, 4232 (2016)

    Google Scholar 

  9. X. Liu, H. Nishikawa, Low-pressure Cu–Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging. Scr. Mater. 120, 80 (2016)

    Article  Google Scholar 

  10. T. Ishizaki, T. Satoh, A. Kuno, A. Tane, M. Yanase, F. Osawa, Y. Yamada, Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. Microelectron. Reliab. 53, 1543 (2013)

    Article  Google Scholar 

  11. J. Yan, G. Zou, Y. Zhang, J. Li, L. Liu, A. Wu, Y. N. Zhou, Metal–metal bonding process using Cu+ Ag mixed nanoparticles. Mater. Trans. 54, 879 (2013)

    Article  Google Scholar 

  12. Y. Kobayashi, Y. Abe, T. Maeda, Y. Yasuda, T. Morita, Metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles. J. Mater. Res. Technol. 3, 114 (2014)

    Article  Google Scholar 

  13. N. Hiroshi, H. Tomoaki, T. Tadashi, Bonding process of Cu/Cu joint using Cu nanoparticle paste. Trans. JWRI 40, 33 (2011)

    Google Scholar 

  14. S. Krishnan, A. S. M. A. Haseeb, M. R. Johan, Preparation and low-temperature sintering of Cu nanoparticles for high-power devices. IEEE Trans. Compon. Packag. Manuf. Technol. 2, 587 (2012)

    Article  Google Scholar 

  15. Y. Jianfeng, Z. Guisheng, H. Anming, Y. N. Zhou, Preparation of PVP coated Cu NPs and the application for low-temperature bonding. J. Mater. Chem. 21, 15981 (2011)

    Article  Google Scholar 

  16. C. -X. Yang, X. Li, G. -Q. Lu, Y. -H. Mei, Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature. Mater. Sci. Eng. A 660, 71 (2016)

    Article  Google Scholar 

  17. A. Sharif, C. L. Gan, Z. Chen, Transient liquid phase Ag-based solder technology for high temperature packaging applications. J. Alloy Compd. 587, 365 (2014)

    Article  Google Scholar 

  18. M. Fujino, H. Narusawa, Y. Kuramochi, E. Higurashi, T. Suga, T. Shiratori, M. Mizukoshi, Jpn. J. Appl. Phys. 55, 04EC14 (2016)

    Article  Google Scholar 

  19. F. Lang, H. Yamaguchi, H. Nakagawa, H. Sato, High temperature resistant joint technology for SiC power devices using transient liquid phase sintering process, 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, pp. 157–161 (2012)

  20. H. Greve, L. -Y. Chen, I. Fox, F. Patrick McCluskey, Transient liquid phase sintered for power electronics, in IEEE Electronic Components and Technology Conference, 435 (2013)

  21. T. Ishizaki, R. Watanabe, Pressureless bonding by use of Cu and Sn mixed nanoparticles. J. Electron. Mater. 43, 4413 (2014)

    Article  Google Scholar 

  22. O. Mokhtari, H. Nishikawa, The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles. Adv. Powder Technol. 27, 1000 (2016)

    Article  Google Scholar 

  23. S. Tajima, T. Satoh, T. Ishizaki, M. Usui, Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment. J. Mater. Sci. 28, 8764 (2017)

    Google Scholar 

  24. T. Satoh, T. Ishizaki, M. Usui, Nanoparticle/solder hybrid joints for next-generation power semiconductor modules. Mater. Design 24, 203 (2017)

    Article  Google Scholar 

  25. E. Ide, A. Hirose, K. F. Kobayashi, Influence of bonding condition on bonding process using ag metallo-organic nanoparticles for high temperature lead-free packaging. Mater. Trans. 47, 211 (2006)

    Article  Google Scholar 

  26. http://everyspec.com/MIL-STD/MIL-STD-0800-0899/MIL-STD-883K_54326/. Accessed 10 Oct 2016

  27. T. D’Hondt, S. F. Corbin, Thermal analysis of the compositional shift in a transient liquid phase during sintering of a ternary Cu-Sn-Bi powder mixture. Metall. Mater. Trans. A 37 A, 217 (2006)

    Article  Google Scholar 

  28. http://www.metallurgy.nist.gov/phase/solder/bicusn.html. Accessed 1 May 2017

  29. X. Deng, N. Chawla, K. K. Chawla, M. Koopman, Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation. Acta Mater. 52, 4291 (2004)

    Article  Google Scholar 

  30. W. Yang, M. Akaike, M. Fujino, T. Suga, A combined process of formic aced pretreatment for low-temperature bonding of copper electrodes. ECS J Solid State Sci. Technol. 2, 271 (2013)

    Article  Google Scholar 

  31. C. Izutani, D. Fukagawa, M. Miyasita, M. Ito, N. Sugimura, R. Aoyama, T. Gotoh, T. Shibue, Y. Igarashi, H. Oshio, The materials characterization central laboratory: an open-ended laboratory program for fourth-year undergraduate and graduate students. J. Chem. Educ. 93, 1667 (2016)

    Article  Google Scholar 

Download references

Acknowledgements

This paper is based on results obtained from a project subsidized by the New Energy and Industrial Technology Development Organization (NEDO), Japan. The authors gratefully acknowledged Dr. Yoshikazu Takahashi, Dr. Yoshinari Ikeda, Mr. Hiromichi Gohara, and Mr. Ryouichi Kato from Fuji Electric Co. Ltd. Authors also thank The Material Characterization Central Laboratory, Waseda University for DSC test [31].

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, Waseda University, Okubo 3-4-1, Shinjuku-ku, Tokyo, 169-8555, Japan

    M. Khairi Faiz, Kazuma Bansho, Tomoyuki Miyashita & Makoto Yoshida

  2. Department of Precision Engineering, The University of Tokyo, Hongo 7-3-1, Bunkyo-ku, Tokyo, 113-8656, Japan

    Tadatomo Suga

  3. Kagami Memorial Research Institute for Materials Science and Technology, Waseda University, 2-8-6, Nishi-Waseda, Shinjuku, Tokyo, 169-0051, Japan

    Makoto Yoshida

Authors
  1. M. Khairi Faiz
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Kazuma Bansho
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Tadatomo Suga
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Tomoyuki Miyashita
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Makoto Yoshida
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to M. Khairi Faiz.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Khairi Faiz, M., Bansho, K., Suga, T. et al. Low temperature Cu–Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn–Bi eutectic powders. J Mater Sci: Mater Electron 28, 16433–16443 (2017). https://doi.org/10.1007/s10854-017-7554-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-017-7554-6

Search

Navigation