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Effect of Zn on properties and microstructure of SnAgCu alloy

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Abstract

The microstructures, wettabilities and mechanical properties of SnAgCu-xZn (x = 0, 0.5, 0.8, 1.0, 1.2, 2.0, 2.5, 3.0) solders were investigated, respectively. The results indicated that adding small amount of Zn can evidently improve the wettability, mechanical properties and refine the microstructure of SnAgCu lead-free solder. However, there existed an effective range for the Zn addition, the best Zn content was found to be 0.8 % in the current study. Moreover, the presence of Zn in the solders plays a major role in inhibiting the growth of Cu–Sn intermetallic layer in the solder/Cu interface. Based on thermal-cycling tests, it is demonstrated that the addition of Zn can enhance the thermal-fatigue properties of SnAgCu solder joints.

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Acknowledgments

The authors greatly appreciate the financial supported by the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation (JSAWS-11-03) and the Xuzhou Normal University Foundation (11XLR16).

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang, Ji-guang Han, Cheng-wen He & Yong-huan Guo

  2. Provincial Key Laboratory of Advanced Welding, Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Liang Zhang

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Correspondence to Liang Zhang.

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Zhang, L., Han, Jg., He, Cw. et al. Effect of Zn on properties and microstructure of SnAgCu alloy. J Mater Sci: Mater Electron 23, 1950–1956 (2012). https://doi.org/10.1007/s10854-012-0686-9

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  • DOI: https://doi.org/10.1007/s10854-012-0686-9

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