Skip to main content
SpringerLink
Log in

Preparation of non-spherical silica composite abrasives by lanthanum ion-induced effect and its chemical–mechanical polishing properties on sapphire substrates

  • Ceramics
  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

Chemical–mechanical polishing is the only technology that can provide a global planarization, and has become widely accepted. Abrasives are one of the important factors influencing chemical–mechanical polishing. In order to improve surface planarization and increase material removal rate of sapphire substrates, non-spherical silica composite abrasives were synthesized by lanthanum ion-induced effect-assisted growth method. Scanning electron microscopy showed the morphologies of non-spherical silica composite abrasives were peanut-shaped, chemical–mechanical polishing tests displayed the material removal rate of the non-spherical silica composite abrasives increased by 32.6% compared with spherical silica composite abrasives, Ambios Xi-100 surface profiler indicated the best surface roughness of sapphire substrate was 1.540 nm, and the element compositions of solids after polishing were analyzed by X-ray photoelectron spectroscopy, which investigated the interactions between abrasives and sapphire substrates. Non-spherical silica composite abrasives may lead to more solid-chemical reactions with sapphire substrates, and higher material removal rate may be also attributed to the mechanical grinding effect enhanced owing to the unique shape to achieve the purpose of material removal.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10

Similar content being viewed by others

References

  1. Li ZC, Pei ZJ, Funkenbusch PD (2011) Machining processes for sapphire wafers: a literature review. Proc Ins Mech Eng Part B J Eng Manuf 225:975–989

    Article  Google Scholar 

  2. Lee H, Lee H, Jeong H, Si Cho, Lee Y (2012) Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer. J Nanosci Nanotechnol 12:1256–1259

    Article  Google Scholar 

  3. Nakamura S (2003) InGaN-based laser diodes. Rev Mater Res 28:125–152

    Google Scholar 

  4. Herzog AH, Walsh RJ (1965) Process for polishing semiconductor materials. US Patent 3170273 A

  5. Lin Z, Huang W, Tsai JS (2012) A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads. J Mech Sci Technol 26:2353–2364

    Article  Google Scholar 

  6. Zhu H, Tessaroto LA, Sabia R, Greenhut VA, Smith M (2004) Chemical mechanical polishing (CMP) anisotropy in sapphire. Appl Surf Sci 236:120–130

    Article  Google Scholar 

  7. Ma P, Lei H, Chen RL (2016) Preparation of cobalt-doped colloidal silica abrasives and their chemical mechanical polishing performances on sapphire. Micro Nano Lett 10:657–661

    Article  Google Scholar 

  8. Wang X, Lei H, Chen RL (2017) CMP behavior of alumina/metatitanic acid core-shell abrasives on sapphire substrates. Precis Eng 50:263–268

    Article  Google Scholar 

  9. Chen GL, Liu DF, Chen T, She YX (2016) Dispersion stability of CeO2 nano particles polishing agent and its properties in chemical mechanical polishing process. Surf Technol 45:187–193

    Google Scholar 

  10. Lei H, Chu FL, Xiao BQ, Tu XF, Hua X, Qiu HN (2010) Preparation of silica/ceria nano composite abrasive and its CMP behavior on hard disk substrate. Microelectron Eng 87:1747–1750

    Article  Google Scholar 

  11. Volkov DO, Dandu PRV, Goodman H, Santora B, Sokolov I (2011) Influence of adhesion of silica and ceria abrasive nanoparticles on chemical–mechanical planarization of silica surfaces. Appl Surf Sci 257:8518–8524

    Article  Google Scholar 

  12. Park SW, Seo YJ, Lee WS (2008) A study on the chemical mechanical polishing of oxide film using a zirconia (ZrO2)-mixed abrasive slurry (MAS). Elsevier, Amsterdam

    Google Scholar 

  13. Bun-Athuek N, Yoshimoto Y, Sakai K, Khajornrungruang P, Suzuki K (2017) Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire. Jpn J Appl Phys 56:07KB01

    Article  Google Scholar 

  14. Lei H, Liu TT (2017) Nd3+-doped colloidal SiO2 composite abrasives: synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers. Appl Surf Sci 413:16–26

    Article  Google Scholar 

  15. Bai LS, Xiong W, Chu XF, Dong YP, Zhang WB (2014) Preparation of nano SiO2/CeO2 composite particles and their applications to CMP on sapphire substrates. Opt Precis Eng 22:1289–1295

    Article  Google Scholar 

  16. Lei H, Huang LQ, Gu Q (2017) Synthesis of Zn-doped colloidal SiO2, abrasives and their applications in sapphire chemical mechanical polishing slurry. J Mater Sci Mater Electron 28:1229–1237

    Article  Google Scholar 

  17. Lei H, Gu Q (2015) Preparation of Cu-doped colloidal SiO2, abrasives and their chemical mechanical polishing behavior on sapphire substrates. J Mater Sci Mater Electron 26:10194–10200

    Article  Google Scholar 

  18. Zhang BC, Lei H, Chen Y (2017) Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire. Friction 9:1–8

    Google Scholar 

  19. Lee H, Lee D, Kim M, Jeong H (2017) Effect of mixing ratio of non-spherical particles in colloidal silica slurry on oxide CMP. Int J Precis Eng Manuf 18:1333–1338

    Article  Google Scholar 

  20. Lee H, Kim M, Jeong H (2015) Effect of non-spherical colloidal silica particles on removal rate in oxide CMP. Int J Precis Eng Manuf 16:2611–2616

    Article  Google Scholar 

  21. Liang CL, Wang LY, Liu WL, Song ZT (2014) Non-spherical colloidal silica particles—Preparation, application and model. Colloids Surf A Physicochem Eng Asp 457:67–72

    Article  Google Scholar 

  22. Shih ZW, Chang KY, Tseng CL, Ro CY (2003) Method for preparing shape-changed nanosize colloidal silica. US Patent 20030113251 A1

  23. Negrych JA, Haag G, Rall PE, Corbell WJ (2002) Abrasive media and aqueous slurries for chemical mechanical polishing and planarization. US Patent 6334880

  24. Liang CL, Liu WL, Zheng YH, Ji XL, Li SS, Yin WJ, Guo XH, Song ZT (2016) Fractal nature of non-spherical silica particles via facile synthesis for the abrasive particles in chemical mechanical polishing. Colloids Surf A Physicochem Eng Asp 500:146–153

    Article  Google Scholar 

  25. Vovk EA, Budnikov AT, Dobrotvorskaya MV, Krivonogov SI, Dan’Ko AY (2012) Mechanism of the interaction between Al2O3 and SiO2 during the chemical-mechanical polishing of sapphire with silicon dioxide. J Surf Invest X ray Synchrotron Neutron Tech 6:115–121

    Article  Google Scholar 

  26. Barr TL (1978) ChemInform abstract: an ESCA study of the termination of the passivation of elemental metals. Chem Inf 9:1801–1810

    Google Scholar 

  27. Lei H, Tong KY (2016) Preparation of La-doped colloidal SiO2 abrasives and their chemical mechanical polishing behavior on sapphire substrates. Precis Eng 44:124–130

    Article  Google Scholar 

  28. Zhang ZY, Lu XC, Han BL, Luo JB (2007) Rare earth effect on microstructure, mechanical and tribological properties of CoCrW coatings. Mater Sci Eng A 444:92–98

    Article  Google Scholar 

  29. Jacob KT, Panwar P, Gupta P, Singh P (2014) Use of composition-graded bi-electrolyte cells for thermodynamic studies on lanthanum aluminates. J Electrochem Soc 161:H343–H349

    Article  Google Scholar 

  30. Lei H, Tong KY, Wang ZY (2016) Preparation of Ce-doped colloidal SiO2 composite abrasives and their chemical mechanical polishing behavior on sapphire substrates. Mater Chem Phys 172:26–31

    Article  Google Scholar 

  31. Zhao YW, Chang L (2002) A micro-contact and wear model for chemical–mechanical polishing of silicon wafers. Wear 252:220–226

    Article  Google Scholar 

  32. Ahmadi G, Xia X (2001) A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process. J Electrochem Soc 148:G99–G109

    Article  Google Scholar 

  33. Luo JF, Dornfeld DA (2001) Material removal mechanism in chemical mechanical polishing: theory and modeling. IEEE Trans Semiconduct Manuf 14:112–133

    Article  Google Scholar 

  34. Li WW, Diao JX (2013) The preparation of nanometer non spherical colloidal silica and its polishing character. ECS Trans 52:507–512

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant Number 51475279).

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Shanghai University, Shanghai, 200444, China

    Yue Dong, Hong Lei & Wenqing Liu

  2. Research Center of Nano Science and Technology, Shanghai University, Shanghai, 200444, China

    Yue Dong, Hong Lei, Tianxian Wang & Lei Xu

Authors
  1. Yue Dong
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hong Lei
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Wenqing Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Tianxian Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Lei Xu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Hong Lei.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Dong, Y., Lei, H., Liu, W. et al. Preparation of non-spherical silica composite abrasives by lanthanum ion-induced effect and its chemical–mechanical polishing properties on sapphire substrates. J Mater Sci 53, 10732–10742 (2018). https://doi.org/10.1007/s10853-018-2357-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10853-018-2357-6

Keywords

Search

Navigation