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Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

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Abstract

Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC) was investigated with current density of 5 × 103 A/cm2 at room temperature and 100 °C, respectively. Results indicate that tiny RE addition to eutectic SnBi solder alloy can make the energy of interfaces and grain boundaries decrease, restrain the movement of dislocations and grain boundary sliding. Therefore, phase segregation and IMC growth will be effectively suppressed which enhances the electromigration resistance.

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Acknowledgement

The authors acknowledge the financial support of this work from the New Century Talent Support Program, Ministry of Education, and the Funding Project PHR (IHLB).

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Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100124, China

    Hongwen He, Guangchen Xu & Fu Guo

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  1. Hongwen He
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  2. Guangchen Xu
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  3. Fu Guo
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Correspondence to Hongwen He.

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He, H., Xu, G. & Guo, F. Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple. J Mater Sci 44, 2089–2096 (2009). https://doi.org/10.1007/s10853-009-3276-3

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  • DOI: https://doi.org/10.1007/s10853-009-3276-3

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