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An adaptive feature reconstruction network for the precise segmentation of surface defects on printed circuit boards

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Abstract

Segmentation networks based on deep learning are widely used in the field of industrial vision inspection, including for the precise segmentation of surface defects on printed circuit boards (PCBs). However, most previous studies have focused only on the utilization of defect samples with visible defects and underestimated the value of template samples without surface defects. In fact, template samples can provide sufficient prior information to identify defects and are not difficult to obtain in many manufacturing scenarios. Therefore, an adaptive feature reconstruction network (AFRNet) is proposed in this paper to utilize these two types of samples. Specifically, AFRNet consists of two main components: a Siamese encoder with shared parameters for extracting features from the input sample pair, and a symmetrical feature reconstruction module for adaptively fusing these extracted features. Similar image-level and feature-level fusion schemes, as well as spatial misalignment caused by unaligned sample pairs have been carefully studied. Extensive experiments on a real-world PCB surface-defect dataset confirm the effectiveness of the proposed method, demonstrating that it can significantly improve the segmentation performance of multiple baselines, such as DANet, PSPNet and DeepLabv3.

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Notes

  1. The PCB surface-defect dataset is publicly available at https://github.com/youtang1993/MeiweiPCB.

  2. https://pytorch.org/.

  3. https://github.com/open-mmlab/mmsegmentation.

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Acknowledgements

This work was partially supported by the Key Areas Research and Development Program of Guangdong Province under Grant 2018B010109007 and the Key-Area Research and Development Program of Guangzhou under Grant 202007030004.

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Correspondence to Jianhuang Lai.

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Kang, D., Lai, J., Zhu, J. et al. An adaptive feature reconstruction network for the precise segmentation of surface defects on printed circuit boards. J Intell Manuf 34, 3197–3214 (2023). https://doi.org/10.1007/s10845-022-02008-w

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