Abstract
In this paper, we present a room temperature two-step electrochemical process for the deposition of large area (∼10 cm2) nanocrystalline ferrite thin films. As an example, the optimized conditions for the deposition of copper, nickel and cobalt ferrites on different conducting substrates and their physical properties are reviewed. The films are spinel in crystal structure and well adherent to the substrates. The electrical and magnetic properties of the films after annealing are comparable to the properties obtained with the films formed with other physical and chemical techniques.
Similar content being viewed by others
References
B. Viswanathan and V.R.K. Murthy, Ferrite Materials (Springer-Verlag, Berlin 1990).
F. Cheng, Z. Peng, Z. Xu, C. Liao, and C. Yan, Thin Solid Films, 339, 109 (1999).
D.M. Schleich and Y. Zhang, Mater. Res. Bull., 30, 447 (1995).
I. Nedkov, T. Merodiiska, L. Milenova, and T. Koutzarova, J. Magn. Magn. Mater., 211, 296 (2000).
M. Abe, MRS Bull., 25, 51 (2000).
S.D. Sartale and C.D. Lokhande, Mater. Chem. Phys., 70, 274 (2001).
S.D. Sartale and C.D. Lokhande, Ind. J. Mater. Sci. Engg., 7, 404 (2000).
S.D. Sartale and C.D. Lokhande, Ceramic International, 28, 467 (2002).
A. Brenner, Electrodeposition of alloys. Vol. I and II (Academic Press, New York 1963).
K. Sasaki and J.B. Talbot, J. Electrochem. Soc., 147 (2000) 189, andreferences therein.
N. Zech, E.J. Podlaha, and D. Landolt, J. Electrochem. Soc., 146 (1999) 2886, and references therein.
CRC Hand Book of Chemistry and Physics, 79th edition, edited by D.R. Lide, (CRC Press, Boca Raton FL, 1998–1999).
Y. Kitamoto and M. Abe, J. Phys. IV France, 7, C1–595 (1997).
V. Narasimhamurthy and B.S. Sheshadri, Metal Finishing, 95, 44 (1997).
JCPDS-ICDD Card no. 34-425; 1994.
JCPDS-ICDD Card no. 44-1485; 1994.
JCPDS-ICDD Card no: 22-1086; 1994.
F. Cheng, Z. Peng, C. Liao, Z. Xu, S. Gao, C. Yan, D. Wang, and J. Wanh, Solid State Commn., 107, 471 (1998).
R.D. Waldron, Phys. Rev., 99, 1727 (1955).
S.A. Mazen, Mater. Chem. Phys., 62, 131 (2000).
C. Jovalekic, M. Zdujic, A. Radakovic, and M. Mitric, Mater. Lett., 24, 365 (1995).
M.S. Lee, T.Y. Kim, C.S. Lee, J.C. Park, Y.I. Kim, and D. Kim, J. Magn. Magn.Mater., 268, 62 (2004).
S.S. Bellad and C.H. Bhosale, Thin Solid Films, 322, 93 (1998).
M. Desai, S. Prasad, N. Venkataramani, I. Samajdar, A.K. Nigam, and R. Krishnana, J. Appl. Phys., 91, 2220 (2002).
I. Nedkov, T. Merodiska, L. Milenova, and T. Koutzarova, J. Magn. Magn. Mater., 11, 296 (2000).
T. Tsuchiya, H. Yamashiro, T. Sei, and T. Inamura, J. Mater. Sci., 27, 3645(1992).
F. Cheng, Z. Peng, C. Liao, Z. Xu, S. Gao, C. Yan, D. Wang, and J. Wang, Solid State Comm., 107, 471 (1998).
T.H. Hai, H.T.B. Van, T.C. Phong, and M. Abe, Physica B, 327, 194 (2003).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Sartale, S.D., Lokhande, C.D. A Room Temperature Two-Step Electrochemical Process for Large Area Nanocrystalline Ferrite Thin Films Deposition. J Electroceram 15, 35–44 (2005). https://doi.org/10.1007/s10832-005-1076-y
Received:
Revised:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s10832-005-1076-y