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Analysis of dynamic stress intensity factors for interfacial crack near shallow circular inclusion in bi-material half-space to SH wave

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Abstract

An analytical approach is used to investigate the SH-wave scattering problems of the bi-material half-space including a circular inclusion embedded and an interfacial crack. Considering the multiple scattering phenomena between the boundaries and the circular inclusion, the “image” principle is used to establish the expressions of the wave field. With the aid of interfacial conjunction, the interfacial crack is constructed. According to the displacement and stress continuity conditions, the Fredholm integral equations of the first kind are obtained to determine the unknown forces attached to the linking sections. Finally, analytical expressions for dynamic stress intensity factors are obtained. The numerical results for dynamic stress intensity factors are presented graphically considering the factors of the crack length, the incident wave number, the inclusion defect and the different media parameters.

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References

  1. Datta, S.K.: Diffraction of SH-wave by an edge crack. J. Appl. Mech. 46, 101–106 (1979)

    Article  MATH  Google Scholar 

  2. Gai, B.Z.: Scattering of SH wave by a crack in nonhomogeneous interlayer. J. Harbin Inst. Technol. 4, 99–102 (1997)

    Google Scholar 

  3. Hassan, A., Song, T.S.: Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials. Appl. Math. Mech. 35, 1261–1270 (2014)

    Article  MathSciNet  MATH  Google Scholar 

  4. Huang, J.Y.: Interaction of SH-wave with a finite crack in a half-space. Eng. Fract. Mech. 51, 217–224 (1995)

    Article  Google Scholar 

  5. Keer, L.M., Luong, W.C.: Diffraction of waves and stress intensity factors in a cracked layered composite. J. Acout. Soc. Am. 56, 1681–1686 (1974)

    Article  MATH  Google Scholar 

  6. Liu, D.K., Liu, H.W.: Scattering of SH wave by cracks originating at a circular hole edge and dynamic stress intensity factor. Acta Mech. Sin. 31, 292–299 (1999)

    Google Scholar 

  7. Mal, A.K.: A note on the low frequency diffraction of elastic waves by a Griffith crack. Int. J. Eng. Sci. 10, 609–612 (1972)

    Article  Google Scholar 

  8. Qi, H., Shi, Y., Liu, D.K.: Interaction of a circular cavity and a beeline crack in right-angle plane impacted by SH-wave. J. Harbin Inst. Technol. 16, 548–553 (2009)

    Google Scholar 

  9. Du, J., Jin, X., Wang, J., Zhou, Y.: SH wave propagation in a cylindrically layered piezoelectric structure with initial stress. Acta Mech. 191, 59–74 (2007)

    Article  MATH  Google Scholar 

  10. Gaur, A.M., Rana, D.S.: Dispersion relations for SH waves propagation in a porous piezoelectric (PZT-PVDF) composite structure. Acta Mech. 226, 4017–4029 (2015)

    Article  MathSciNet  MATH  Google Scholar 

  11. Loeber, J.F., Sih, G.C.: Diffraction of antiplane shear wave by a finite crack. J. Aoust. Soc. Am. 44, 90–98 (1968)

    Article  MATH  Google Scholar 

  12. Pao, Y.H.: Applied mechanics in science and engineering. Appl. Mech. Rev. 51, 141–153 (1998)

    Article  Google Scholar 

  13. Qi, H., Yang, J.: Dynamic analysis for circular inclusions of arbitrary positions near interfacial crack impacted by SH-wave in half space. Eur. J. Mech. A/Solids 36, 18–24 (2012)

    Article  MathSciNet  MATH  Google Scholar 

  14. Liu, D.K., Lin, H.: Scattering of SH-waves by an interacting interface linear crack and a circular cavity near bimaterial interface. Acta Mech. Sin. 20, 317–326 (2004)

    Article  Google Scholar 

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Authors and Affiliations

  1. School of Mechanical Engineering, Shanghai Dianji University, Shanghai, 200245, People’s Republic of China

    Jie Yang

  2. College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin, 150001, People’s Republic of China

    Jie Yang & Hui Qi

Authors
  1. Jie Yang
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  2. Hui Qi
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Correspondence to Jie Yang.

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Yang, J., Qi, H. Analysis of dynamic stress intensity factors for interfacial crack near shallow circular inclusion in bi-material half-space to SH wave. Acta Mech 227, 3703–3714 (2016). https://doi.org/10.1007/s00707-016-1678-2

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  • DOI: https://doi.org/10.1007/s00707-016-1678-2

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