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Multilayer polyimide film substrates for interconnections in microsystems

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Abstract

 Currently there is a great interest in flexible substrates for their use in the packaging of semiconductors. They allow high packaging density and permit mechanical motion of the components, if necessary. This paper describes a new substrate material which possesses a high flexibility and which can be used for the realization of interconnection cables and MCM-D. These substrates are not only highly flexible but also mechanically stable, chemically inert and can be produced with the same processes as those for rigid substrates.

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Authors and Affiliations

  1. Hightec MC AG, Fabrikstrasse, CH-5600 Lenzburg, Switzerland, , , , , , CH

    A. Fach, Y. Athanassov, U. Brunner, D. Hablützel, B. Ketterer & J. Link

Authors
  1. A. Fach
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  2. Y. Athanassov
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  3. U. Brunner
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  4. D. Hablützel
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  5. B. Ketterer
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  6. J. Link
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Received: 14 December 1998 / Accepted: 28 December 1998

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Fach, A., Athanassov, Y., Brunner, U. et al. Multilayer polyimide film substrates for interconnections in microsystems. Microsystem Technologies 5, 166–168 (1999). https://doi.org/10.1007/s005420050158

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  • DOI: https://doi.org/10.1007/s005420050158

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