Summary
Thermally stimulated current (TSC) and relaxation map analysis (RMA) was used to characterize the low temperature relaxation of epoxy resin modified with siloxane oligomers. In aminopropyl-terminated siloxane oligomer (ATSO) the β-relaxation of epoxy resin and the glass transition temperature of siloxane oligomer were folded regardless of the concentration of diphenyl. The β-relaxation of epoxy resin and the glass transition temperature of oxiranylmethoxy-terminated siloxane oligomer (OTSO) were folded and shifted to higher temperature as the concentration of diphenyl in siloxane oligomer increased. In the systems containing of diphenyl in siloxane oligomer a new relaxation peak due to the space charge was observed in the range of −80°C to −50° C and −30°C to 5°C. As the concentration of diphenyl increased the compensation temperature (Tc) and the degree-of-disorder (DOD) were increased while the compensation time, τc was decreased.
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Shin, S.M., Shin, D.K. & Lee, D.C. Study of siloxane-modified epoxy resin using thermally stimulated current(II). Polymer Bulletin 39, 193–199 (1997). https://doi.org/10.1007/s002890050138
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DOI: https://doi.org/10.1007/s002890050138