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Modification of wood with silicon compounds. inorganic silicon compounds and sol-gel systems: a review

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Abstract

This review describes the treatment of wood with various inorganic silicon compounds. Among these compounds silicofluorides represent one of the long-known classes of wood preservatives based on silicon. Data on an organic fluorosilicon compound (“silafluofen”) are additionally presented. The mode of action of these fluorides is based on their biocidal action. “Water glass”, an alkali silicate, was able to enhance the durability of wood but showed some important drawbacks. Because of its high hygroscopicity and its high pH values, increased moisture absorption and strength loss of wood was frequently observed. Wood treated with tetraalkoxysilanes showed an enhanced dimensional stability, especially when the hydrolysis and the condensation of the silanes was controlled to react within the cell wall. Durability and fire resistance were improved to a certain degree and could be significantly enhanced by addition of boron compounds.

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Abbreviations

ASE:

antishrink efficiency

CCA:

(preservatives based on) copper, chromium, arsenic

CSAS:

colloidal silicic acid solution

EDX:

energy dispersive X-ray analysis

EPMA:

electron probe X-ray microanalysis

HFOETMOS:

2-heptadecafluorooctylethyltrimethoxysilane

MEE:

moisture-excluding efficiency

MoE:

modulus of elasticity

r.h.:

relative humidity

SAMS:

silicic acid monomer solution

SEM:

scanning electron microscopy

TEOS:

tetraethoxysilane/triethyl orthosilicate

TEP:

triethylphosphite

TGA:

thermogravimetric analysis

TMB:

trimethylborate

TMOS:

tetramethoxysilane

TMP:

trimethylphosphite

TPOS:

tetrapropoxysilane

WPG:

weight percent gain

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  1. Institute of Wood Biology and Technology, University of Göttingen, Büsgenweg 4, 37077, Göttingen, Germany

    Carsten Mai & Holger Militz

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  1. Carsten Mai
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  2. Holger Militz
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Correspondence to Carsten Mai.

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Mai, C., Militz, H. Modification of wood with silicon compounds. inorganic silicon compounds and sol-gel systems: a review. Wood Sci Technol 37, 339–348 (2004). https://doi.org/10.1007/s00226-003-0205-5

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