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Modeling and investigation of minimum chip thickness for silicon carbide during quasi-intermittent vibration–assisted swing cutting

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Abstract

In micromachining, the quasi-intermittent vibration—assisted swing cutting technology alleviates the residual height problem of elliptical vibration–assisted cutting (EVC) and inherits its intermittent machining characteristics. The minimum chip thickness has a significant impact on cutting forces, tool wear, and process stability when working with difficult-to-machine materials. This study thoroughly examines the impact of cutting parameters and tool parameters on the quality of the workpiece during machining in order to better understand the time-varying characteristics of the quasi-intermittent vibration–assisted swing cutting (QVASC) machining process and the size effect on micro-cutting of silicon carbide crystal. This paper created the minimum chip thickness prediction model suited to QVASC machining process. The effects of variables such as cutting velocity and tool inclination on the minimum chip thickness were discussed as well as the scribing tests that were conducted on such challenging materials as silicon carbide. The research findings shown that during the machining process, the critical undeformed chip thickness of silicon carbide decreased continuously as the cutting velocity sequentially increased (1.51 mm/min, 1.88 mm/min, 2.26 mm/min); under the down inclination angle (0–10°), the critical undeformed chip thickness also continuously decreased. These results confirm that cutting too fast reduces the instantaneous undeformed chip thickness, which is not conducive to ductile removal.

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References

  1. Lu M, Zhao D, Lin J, Zhou X, Zhou J, Chen B, Wang H (2018) Design and analysis of a novel piezoelectrically actuated vibration assisted rotation cutting system. Smart Mater Struct 27(9):095020

    Article  Google Scholar 

  2. Zhu Z, Lu M, Lin J, Zhou J, Yi A, Zhuang X (2020) A tool path generation method for quasi-intermittent vibration assisted swing cutting. Proc Inst Mech Eng E: J Process Mech Eng 234(6):624–633

    Article  Google Scholar 

  3. Bifano TG (1991) Ductile regime grinding: a new technology for machining brittle materials[J]. Trans ASME J Eng Ind 113:184

  4. Stephenson DJ, Veselovac D, Manley S, Corbett J (2001) Ultra-precision grinding of hard steels. Precis Eng 25(4):336–345

    Article  Google Scholar 

  5. Malekian M, Mostofa MG, Park SS, Jun MBG (2012) Modeling of minimum uncut chip thickness in micro machining of aluminum. J Mater Process Technol 212(3):553–559

    Article  Google Scholar 

  6. Leksycki K, Feldshtein E, Królczyk GM, Legutko S (2020) On the chip shaping and surface topography when finish cutting 17–4 PH precipitation-hardening stainless steel under near-dry cutting conditions. Materials 13(9):2188

    Article  Google Scholar 

  7. Yuan ZJ, Zhou M, Dong S (1996) Effect of diamond tool sharpness on minimum cutting thickness and cutting surface integrity in ultraprecision machining. J Mater Process Technol 62(4):327–330

    Article  Google Scholar 

  8. Grzesik W (1996) A revised model for predicting surface roughness in turning. Wear 194(1–2):143–148

    Article  Google Scholar 

  9. Grzesik W (1991) A real picture of plastic deformation concentrated in the chip produced by continuous straight-edged oblique cutting. Int J Mach Tools Manuf 31(3):329–344

    Article  Google Scholar 

  10. Son S, Lim H, Ahn J (2006) The effect of vibration cutting on minimum cutting thickness. Int J Mach Tools Manuf 46(15):2066–2072

    Article  Google Scholar 

  11. Son SM, Lim HS, Ahn JH (2005) Effects of the friction coefficient on the minimum cutting thickness in micro cutting. Int J Mach Tools Manuf 45(4–5):529–535

    Article  Google Scholar 

  12. L’vov NP (1969) Determining the minimum possible chip thickness. Mach Tooling 4:40–45

    Google Scholar 

  13. Puttick KE, Rudman MR, Smith KJ, Franks A, Lindsey K (1989) Single-point diamond machining of glasses. Proc R Soc Lond A Math Phys Sci 426(1870):19–30

  14. Schinker MG, Doll W (1987) Turning of optical glasses at room temperature. In In-Process Optical Metrology for Precision Machining. SPIE 802(1987):70–80

  15. Venkatachalam S, Li X, Liang SY (2009) Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials. J Mater Process Technol 209(7):3306–3319

    Article  Google Scholar 

  16. Przestacki D, Chwalczuk T, Wojciechowski S (2017) The study on minimum uncut chip thickness and cutting forces during laser-assisted turning of WC/NiCr clad layers. The International Journal of Advanced Manufacturing Technology 91:3887–3898

    Article  Google Scholar 

  17. Liu X, DeVor RE, Kapoor SG (2006) An analytical model for the prediction of minimum chip thickness in micromachining. J Manuf Sci Eng Trans ASME 128:474–481

    Article  Google Scholar 

  18. Johnson GR, Holmquist TJ (1992) A computational constitutive model for brittle materials subjected to large strains, high strain rates and high pressures. Shock wave and high-strain-rate phenomena in materials, 1075–1081

  19. Johnson GR, Holmquist TJ (1994) An improved computational constitutive model for brittle materials. In: AIP conference proceedings. 309(1):981–984

  20. Liu X, Jun MB, DeVor RE, Kapoor SG (2004) Cutting mechanisms and their influence on dynamic forces, vibrations and stability in micro-endmilling. In ASME International Mechanical Engineering Congress and Exposition 47136:583–592

  21. Lu M, Guo M, Zhou J, Lin J, Xian J, Diao Y (2022) An analytical cutting force model of quasi-intermittent vibration assisted swing cutting based on predictive machining theory. Proc Inst Mech Eng C J Mech Eng Sci 236(7):3651–3662

    Article  Google Scholar 

  22. Zhu D, Yan S, Li B (2014) Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness. Comput Mater Sci 92:13–21

    Article  Google Scholar 

  23. Pashmforoush F, Esmaeilzare A (2017) Experimentally validated finite element analysis for evaluating subsurface damage depth in glass grinding using Johnson-Holmquist model. Int J Precis Eng Manuf 18:1841–1847

    Article  Google Scholar 

  24. Holmquist TJ, Johnson GR (2005) Characterization and evaluation of silicon carbide for high-velocity impact. J Appl Phys 97(9):093502

    Article  Google Scholar 

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Funding

This work was supported by the National Natural Science Foundation of China (U21A20137), Natural Science Foundation of Jilin Province (YDZJ202201ZYTS534), Jilin Provincial International Cooperation Key Laboratory for High-Performance Manufacturing and Testing (20220502003GH), and Changchun Science and Technology Development Plan Project (21zgg08).

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Authors and Affiliations

  1. Key Laboratory of Micro/Nano and Ultra-Precision Manufacturing (Jilin Province), School of Mechatraonic Engineering, Changchun University of Technology, Changchun, 130012, People’s Republic of China

    Mingqi Guo, Mingming Lu, Jieqiong Lin, Qiang Gao & Yongshen Du

Authors
  1. Mingqi Guo
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  2. Mingming Lu
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  3. Jieqiong Lin
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  4. Qiang Gao
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  5. Yongshen Du
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Contributions

Mingqi Guo: investigation, methodology, validation, writing — original draft, writing — review and editing; Lu Mingming: methodology, validation, experiments, writing — original draft, writing — review and editing; Jieqiong Lin: software, data curation; Gao Qiang: software, data curation; Yongshen Du: supervision, writing — review and editing.

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Correspondence to Mingming Lu or Jieqiong Lin.

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Guo, M., Lu, M., Lin, J. et al. Modeling and investigation of minimum chip thickness for silicon carbide during quasi-intermittent vibration–assisted swing cutting. Int J Adv Manuf Technol 127, 1691–1701 (2023). https://doi.org/10.1007/s00170-023-11546-3

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