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Optimization of the coupled cooling circuit in electromagnetic forming with finite element analysis

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Abstract

Electromagnetic forming has good prospects in light alloy forming. In the EMF process, intense current causes considerable temperature rise in the driving coil, which may reduce the service life of the driving coil. The cooling circuit method is one of the ways to solve this problem by using mutual inductance between the driving coil and the cooling coil to transfer Joule heat. This paper derives the dependence of cooling efficiency on circuit parameters. Then with a validated finite element model, the influence of coupling coefficient, discharge frequency, coil turns, and impedance angle on EMF process are analyzed in detail. The simulation results are in good agreement with the theoretical prediction. In addition, the influence of the switch-on time on the cooling effect and deformation is analyzed at two different frequencies. With the optimized parameter and switch-on time, the Joule heat in the driving coil during the EMF process has a considerable decrease especially at a higher frequency.

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Acknowledgements

Lantao Huang is a member of the IEEE.

Funding

This work was supported in part by the National Natural Science Foundation of China 51607152 and the Presidential Fund of Xiamen University 20720180079.

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Authors and Affiliations

  1. Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen, 361000, Fujian, China

    Lantao Huang, Zinan Ding, Jin Zeng & Yihan Zhou

  2. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore

    Quqin Sun

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  1. Lantao Huang
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  2. Zinan Ding
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  3. Jin Zeng
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  4. Yihan Zhou
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  5. Quqin Sun
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Contributions

Lantao Huang, and Quqin Sun were responsible for deriving formulas. Zinan Ding, Jin Zeng, and Yihan Zhou were responsible for simulation. Lantao Huang, Zinan Ding, and Quqin Sun were involved in the discussion and significantly contributed to making the final draft of the article. All the authors read and approved the final manuscript.

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Correspondence to Quqin Sun.

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Huang, L., Ding, Z., Zeng, J. et al. Optimization of the coupled cooling circuit in electromagnetic forming with finite element analysis. Int J Adv Manuf Technol 116, 2211–2221 (2021). https://doi.org/10.1007/s00170-021-07525-1

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  • DOI: https://doi.org/10.1007/s00170-021-07525-1

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