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Some observations in grinding SiC and silicon carbide ceramic matrix composite material

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Abstract

The ceramic has extensive applications in aeronautics and transportation industry because of outstanding properties, but the processing performance is poor. The carbon fiber-reinforced SiC matrix composite (Cf/SiC) is proposed to improve machining performance. The carbon fibers have important effects on surface quality and forces when machining Cf/SiC materials. But there are few investigations about the related contents. To fill these gaps by comparing SiC and Cf/SiC composites is the main objective of this study. The Cf/SiC materials were machined in two different directions. To explore the grinding mechanism, some evaluation parameters were investigated. The extension of cracks is the main removal method during grinding process of SiC. While matrix craze, fiber fracture, and interfacial debonding are the main remove methods of Cf/SiC composites. While grinding 2.5 D Cf/SiC material, fiber pullout, outcrop, fractures, wear, interfacial debonding, and matrix cracks were the major failure forms. During machining, the roughness of the machined surface decreased with reducing grinding speed vs, whereas the grinding depth ap and feed speed vw brought contrary effects. Meanwhile, the grinding forces gradually improved with increasing ap and vw, and decreasing vs. On the basis of conclusions, the surface roughness and grinding forces of the SiC and 2.5 D Cf/SiC materials could be derived. This series of analysis and researches provides useful technical support on understanding the grinding mechanism of SiC and 2.5 D Cf/SiC material.

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Funding

The author wishes to thank the National Natural Science Foundation of China (No. 51775100) and the Fundamental Research Funds for the Central Universities (No. N180306001 and No. N170306003) for financial assistance.

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Correspondence to Yadong Gong.

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Gong, Y., Qu, S., Yang, Y. et al. Some observations in grinding SiC and silicon carbide ceramic matrix composite material. Int J Adv Manuf Technol 103, 3175–3186 (2019). https://doi.org/10.1007/s00170-019-03735-w

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  • DOI: https://doi.org/10.1007/s00170-019-03735-w

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