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Phase diagrams of (gold+binary solder) ternary alloy systems by smith thermal analysis

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Abstract

Application of the Smith thermal analysis method [1] to the experimental determination of ternary alloy phase diagrams is illustrated by reference to a study of the Au−Pb−Bi system. This system, which is of interest in relation to soft-soldered interconnections in solid state device technology, exhibits a ternary eutectic and several transition peritectic reactions.

Zusammenfassung

Anhand einer Untersuchung des Systemes Au−Pb−Bi wurde die Anwendung der thermoanalytischen Methode von Smith [1] zur experimentellen Bestimmung von ternären Legierungsphasendiagrammen gezeigt. Dieses System mit Bedeutung für weichgelötete Verbindungen in der Technologie der Festkörperbauelemente weist ein ternäres Eutektikum und einige peritektische Umwandlungsreaktionen auf.

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Author notes

  1. W. T. Chao

    Present address: Swinden Laboratories, British Steel Technical, Rotherham, UK

Authors and Affiliations

  1. Materials Science Centre, University of Manchester and UMIST, Grosvenor Street, M1 7HS, Manchester, UK

    F. H. Hayes, W. T. Chao & J. A. J. Robinson

Authors
  1. F. H. Hayes
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  2. W. T. Chao
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  3. J. A. J. Robinson
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Hayes, F.H., Chao, W.T. & Robinson, J.A.J. Phase diagrams of (gold+binary solder) ternary alloy systems by smith thermal analysis. Journal of Thermal Analysis 42, 745–758 (1994). https://doi.org/10.1007/BF02546747

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  • DOI: https://doi.org/10.1007/BF02546747

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