References
Donaldson, P. E. K. (1976) The encapsulation of microelectronic devices for long term surgical implantation,IEEE. Trans,BME-23, 281–285.
Donaldson, P. E. K. andSayer, E. (1981) A technology for implantable hermetic packages. Part I: Design and materials.Med. & Biol. Eng. & Comput.,19, 398–402.
Hench, L. L. andEthridge, E. C. (1982)Biomaterials: an interfacial approach. Academic Press, New York, ISBN 0-12-340280-8, Chap. 4, 42–61.
Ko, W. H. andSpear, T. M. (1983) Packaging materials and techniques for implantable instruments.Eng. in. Med. & Biol. Magazine, IEEE,2, (1), 24–38.
Lin, N. C. andKo, W. H. (1968) A study of microwatt-power pulse carrier transmitter circuits.Med. & Biol. Eng.,6, 309–317.
Lovely, D. F., Hudgins, B. S. andScott, R. N. (1984) Implantable myoelectric control system with sensory feedback.Med. & Biol. Eng. & Comput.,23, 87–89.
Pullen, H. (1980) Microelectric telemetry implants for myoelectric control of prostheses. Final report: NHRDP Project, 607-1127-51, Health & Welfare, Canada, Ottawa.
Traeger, R. K. (1977) Nonhermeticity of polymeric lid sealants.IEEE Trans.,PHP-13, 147–152.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Lovely, D.F., Olive, M.B. & Scott, R.N. Epoxy moulding system for the encapsulation of microelectronic devices suitable for implantation. Med. Biol. Eng. Comput. 24, 206–208 (1986). https://doi.org/10.1007/BF02443939
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF02443939