Skip to main content
Log in

Nondestructive evaluation of model adhesive joints by PVDF piezoelectric film sensors

  • Published:
Experimental Mechanics Aims and scope Submit manuscript

Abstract

Metallized poly(vinylidene fluoride) (PVDF) films can be etched into nondestructive evaluation (NDE) sensor devices. Since these sensors are relatively inexpensive, thin and lightweight, they can be attached permanently to adhesively bonded joints, laminated composites, and other structures to measure structural integrity. The present study has addressed techniques to design, attach, and utilize such sensors for adhesive joint and laminated composite applications. PVDF sensors have been successfully used as NDE transducers in pulse-echo, through-transmission, and acousto-ultrasonic techniques to monitor curing, and to detect porosity and crack propagation in different model joint geometries. Feasibility of several applications has been demonstrated, although several problems remain. The potential of using these techniques for practical bonded structures is also suggested.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. Guyott, C.C.H., Cawley, P. andAdams, R.D., “The Non-destructive Testing of Adhesively Bonded Structure: A Review,”J. Adhesion,20,129–159 (1986).

    Google Scholar 

  2. Adams, R.D. andCawley, P., “A Review of Defect Types and Nondestructive Testing Techniques for Composites and Bonded Joints,”NDT Int.,31,208–221 (1988).

    Google Scholar 

  3. Vary, A., “Acousto-Ultrasonic Characterization of Fiber Reinforced Composites,”Mat. Eval.,40,650–662 (1982).

    Google Scholar 

  4. Fahr, A., Lee, S., Tanary, S. andHaddad, Y., “Estimation of Strength in Adhesively Bonded Specimens by Acousto-Ultrasonic Technique,”Mat. Eval.,47,233–240 (1989).

    Google Scholar 

  5. Tiwari, A., Henneke II, E.G. and Duke, Jr., J.C., “Acousto-Ultrasonic Technique for Assuring Adhesive Bond Quality,” J. Adhesion, to be published.

  6. Stiffer, R. andHenneke II, E.G., “The Application of Poly(vinylidene Fluoride) as an Acoustic Emission Transducer for Fibrous Composite Materials,”Mat. Eval.,41,956–957 (1983).

    Google Scholar 

  7. Pennwalt Corporation, Kynar Piezo Film Technical Manual, Piezo Films Sensors Division, Valley Forge, PA (1987).

    Google Scholar 

  8. Mommaerts, J., Tang, B., Duke, Jr., J.C. andDillard, D.A., “A Feasibility Study of PVDF Sensors to Detect Damage in Adhesive Joints,” (also see J. Mommaerts' Masters thesis),CASSIESM 90-6, Virginia Polytechnic Institute, Blacksburg, VA (Dec. 1990).

    Google Scholar 

  9. Shuford, R.J., Wilde, A.F., Ricca, J.J. andThomas, G.R., “Characterization and Piezoelectric Activity of Stretched and Poled Poly(vinylidene fluoride),”Polymer Eng. and Sci.,16,25–36 (1976).

    Google Scholar 

  10. Chou, S.J., and Ekstrom, R.E., Proc. 1986 SEM Conf. on Exp. Mech., 308–512 (1986).

  11. Dillard, D.A., Anderson, G.L. andDavis, Jr, D.D., “A Preliminary Study of the use of Kynar Piezoelectric Film to measure Peel Stresses in Adhesive Joints,”J. Adhesion,29,245–255 (1989).

    Google Scholar 

  12. Anderson, G.L., Dillard, D.A. et al., Proc. 1990 SEM Conf. on Exp. Mech. (1990).

  13. Anderson, G.L., Raheem, A.R., Robertson, R.C., Elshabini-Riad, A. and Dillard, D.A., “The Development and Use of KYNAR Piezoelectric Film Sensors for the Measurement of Peel Stresses in Adhesive Joints,” EXPERIMENTAL MECHANICS,in review.

  14. Anderson, G.L., Dillard, D.A. and Wightman, J.P., “Improving Bonding to Piezoelectric Poly(vinylidene fluoride),” J. Adhesion, in review.

  15. Scott, W.R. andBloomfield, P.E., “Ditrable Lead Attachment Techniques for PVDF Polymer Transducers with Application to High Voltage Pulsed Ultrasonics,”Ferroelectrics,32,79–83 (1981).

    Google Scholar 

  16. Kline, R.A., Hsiao, C.P. andFidaali, M.A., “Nondestructive Evaluation of Adhesively Bonded Joints,”J. Eng. Mat. and Tech.,108,214–217 (1986).

    Google Scholar 

  17. Das-Gupta, D.K. andDoughty, K., Thin Solid Films,158,93 (1988).

    Article  Google Scholar 

  18. DasGupta, D.K. andAbdullah, M.J., J. Mater. Sci. Letters,7,167 (1988).

    Google Scholar 

  19. Kiernan, M.T. andDuke, Jr., J.C., “Acousto-Ultrasonics as a Monitor of Material Anisotrophy,”Mat. Eval.,46,1105–1113 (1988).

    Google Scholar 

  20. Duncan, R.K. andDillard, D.A., “Light-weight, Permanently Attachable NDE Sensors for Measuring Debonding and Delamination,”CASS/ESM 91-4 report, Virginia Polytechnic Institute, Blacksburg, VA (May 1991)thane bonded joints with few air bubbles in the adhesive bond

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Cite this article

Tang, B., Mommaerts, J., Duncan, R.K. et al. Nondestructive evaluation of model adhesive joints by PVDF piezoelectric film sensors. Experimental Mechanics 33, 102–109 (1993). https://doi.org/10.1007/BF02322485

Download citation

  • Received:

  • Revised:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02322485

Keywords

Navigation