Abstract
The effects of plasma etching on surface structure and chemistry of several papers have been investigated. Plasma etching acts like a fine microtome, continuously removing infinitesimally thin layers at the surface. It has allowed us to observe the internal structure of fibers, and interfiber bonding. The kinetics of plasma etching and its temperature dependence are reported; the thermal activation energy determined from the latter was found to be 0.15 eV. Possible applications of plasma etching techniques to study the structural and physical properites of paper in the z-direction and the distribution of coating material across the thickness of a paper sample are discussed.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
D. T. Clark and W. J. Feast,Polymer Surfaces, Wiley, New York (1978).
M. R. Wertheimer, J. E. Klemberg-Sapieha, and H. P. Schreiber,Thin Solid Films 115, 109 (1984).
S. Wu,Polymer Interface and Adhesion, Marcel Dekker, New York (1982).
C. Y. Kim, J. Evans, and D. A. I. Goring,J. Appl. Polym. Sci 15, 1365 (1971).
W. J. Thoresen,Text. Res. J. 41, 331 (1971).
D. A. I. Goring,Pulp Pap. Mag. Can. 68, T-372 (1967).
R. E. Green,Tappi 48, 80A (1965).
D. A. I. Goring and G. Suranyi,Pulp Pap. Mag. Can. 70, T390 (1969).
G. Suranyi, D. G. Gray, and D. A. I. Goring,Tappi 63, 153 (1986).
M. R. Wertheimer, G. Suranyi, and D. A. I. Goring,Tappi 55, 1707 (1972).
Thin Film Processes, J. L. Vossen and W. Kern, eds., Academic Press, New York (1978).
P. Kassenbeck,Melliand Textilber 39, 55 (1958).
B. J. Spit, inProceedings of the European Regional Conference on Electron Microscopy, Delft, 1960,
B. J. Spit,Polymer 4, 109 (1963).
B. J. Spit,Faserforsch. Textiltech. 18, 161 (1967).
J. Ising and B. J. Spit,Proceedings of the 3rd European Conference on Electron Microscopy, Vol. A, Publishing House of the Czechoslovak Academy of Science, Prague, p. 407.
V. Nikonovich, N. D. Burkhanova, S. A. Leont'eva, and K. U. Usmanov,Cellul. Chem. Tech. 1, 171 (1967).
S. Dumitrescu, G. Rozmarin, E. Ioanid, and A. Ioanid,Cellul. Chem. Technol. 18, 125 (1984).
S. Thomas, inTechniques and Applications of Plasma Chemistry, J. R. Hollahan and A. T. Bell, eds., Wiley-Interscience, New York (1978), Chapter 8.
L. A. Pederson,J. Electrochem. Soc. 129, 205 (1982).
S. R. Cain, F. D. Egito, and F. Emmi,J. Vac. Sci. Technol. A5, 1578 (1987).
R. G. Bosisio, M. R. Wertheimer, and C. Weissfloch,J. Phys. E: Sci. Instrum. 6, 628 (1973).
B. Lamontagne, A. M. Wrobel, G. Jalbert, and M. R. Wertheimer,J. Phys. D: Appl. Phys. 20, 844 (1987).
J. Paraszczak, M. Hatzakis, E. Babich, J. Shaw, E. Arthur, B. Grenon, and M. DePaul,Microcircuit Eng. 2, 517 (1984).
S. Dzioba, G. Este, and H. M. Naguib,J. Electrochem. Soc. 129, 2537 (1982).
F. D. Egito, F. Emmi, R. S. Horwath, and V. Vukanovic,J. Vac. Sci. Technol. B 3, 893 (1985).
M. Kogoma and G. Turban,Plasma Chem. Plasma Process. 6, 349 (1986).
S. Sapieha, J. Klemberg-Sapieha, E. Sacher, and M. R. Wertheimer, in preparation; alsoBull. Am. Phys. Soc. 33, 1227 (1988).
N. J. Beckman and E. I. Plucker,Proceedings of 1973 TAPPI Coating Conference, p. 87.
T. Hattula and P. J. Aschan,Pap. Puu 60, 665 (1978).
P. J. Aschan, T. Hattula, and J. Paakko,Tappi 63, 59 (1980).
J. Kuusi and A. Lehtinen,Pulp Pap. Mag. Can. 71, T37 (1970).
G. Grant, G. S. Clifton, and J. C. Sheppard,Tappi 57, 127 (1974).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Sapieha, S., Wrobel, A.M. & Wertheimer, M.R. Plasma-assisted etching of paper. Plasma Chem Plasma Process 8, 331–346 (1988). https://doi.org/10.1007/BF01020410
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF01020410